Memory - Configuration Proms for FPGAs

Image Part Number Description / PDF Quantity Rfq
AT17F080-30JC

AT17F080-30JC

Roving Networks / Microchip Technology

IC FLASH CONFIG 8M 20PLCC

0

AT17N002-10SC

AT17N002-10SC

Roving Networks / Microchip Technology

IC FPGA 2M CONFIG MEM 20SOIC

0

AT17LV256A-10JC

AT17LV256A-10JC

Roving Networks / Microchip Technology

IC SRL CONFG EEPROM 256K 20-PLCC

0

AT17F080-30BJC

AT17F080-30BJC

Roving Networks / Microchip Technology

IC FLASH CONFIG 8M 44PLCC

0

AT17C65-10JC

AT17C65-10JC

Roving Networks / Microchip Technology

IC SERIAL CONFIG PROM 64K 20PLCC

0

AT17C010A-10QC

AT17C010A-10QC

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 1M 32TQFP

0

AT17LV002A-10JI

AT17LV002A-10JI

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 2M 20-PLCC

0

AT17LV002A-10CU

AT17LV002A-10CU

Roving Networks / Microchip Technology

IC FPGA EEPROM 2M ALTERA 8LAP

0

AT17LV040A-10BJC

AT17LV040A-10BJC

Roving Networks / Microchip Technology

IC SRL CONFG EEPROM 4M LV 44PLCC

0

AT17LV002-10SC

AT17LV002-10SC

Roving Networks / Microchip Technology

IC EEPROM SRL CONFG 2M LV 20SOIC

0

AT17C010A-10PC

AT17C010A-10PC

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 1M 8DIP

0

AT17C128-10NI

AT17C128-10NI

Roving Networks / Microchip Technology

IC EEPROM FPGA 128KB 8-SOIC

0

AT17N040-10TQI

AT17N040-10TQI

Roving Networks / Microchip Technology

IC FPGA 4M CONFIG MEM 44TQFP

0

AT17C512-10CI

AT17C512-10CI

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 512K 8LAP

0

AT17F16-30JI

AT17F16-30JI

Roving Networks / Microchip Technology

IC FLASH CONFIG 16M 20PLCC

0

AT17N256-10NI

AT17N256-10NI

Roving Networks / Microchip Technology

IC FPGA 256K CONFIG MEM 8SOIC

0

AT17LV040-10TQC

AT17LV040-10TQC

Roving Networks / Microchip Technology

IC CONFIG SEEPROM 4M 3.3V 44TQFP

0

AT17LV512-10CI

AT17LV512-10CI

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 512K 8-LAP

0

AT17F040-30VJC

AT17F040-30VJC

Roving Networks / Microchip Technology

IC FLASH CONFIG 4M 20PLCC

0

AT17C002-10JC

AT17C002-10JC

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 2M 20PLCC

0

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
OTP PROMsOne-Time Programmable, low cost, high reliabilityIndustrial control systems
Flash PROMsReprogrammable, high density, moderate endurance5G base stations
EEPROMByte-alterable, high endurance, slower access speedMedical imaging equipment
FRAMLow-power, radiation-hardened, fast write speedAerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

  • Package types: TSSOP, VQFN, BGA
  • Memory array: Floating-gate or antifuse-based technology
  • Interface: SPI, BPI, or parallel bus
  • Voltage rails: 1.2V-3.3V operation with decoupling capacitors
  • Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

ParameterSignificance
Memory density (1Mb-4Gb)Determines maximum FPGA configuration size
Access time (55ns-120ns)Impacts system boot speed
Endurance (10k-100k cycles)Dictates reprogramming lifespan
Data retention (20-100 years)Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)Essential for space applications

5. Application Areas

Primary application domains:

  • Telecommunications: 5G NR base stations, optical transceivers
  • Industrial: Programmable logic controllers (PLCs)
  • Medical: MRI scanners, patient monitoring systems
  • Automotive: ADAS sensor fusion units
  • Defense: Radar signal processing systems

6. Key Manufacturers and Products

ManufacturerProduct SeriesKey Features
MicrochipAT17F Series128Mb SPI interface, -40 C to +125 C
IntelEP180SSecure boot, TSMC 16nm process
XilinxS25FL-VOctal SPI, 400MHz clock rate
CypressFL-S SeriesEnd-to-end data protection

7. Selection Guidelines

Key selection factors:

  • Match memory density to target FPGA's bitstream size
  • Verify interface compatibility (SPI/BPI/parallel)
  • Evaluate environmental requirements (temperature, radiation)
  • Assess security features (encryption, authentication)
  • Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

  • Transition to 3D NAND architecture for densities beyond 8Gb
  • Integration of hardware security modules (HSM)
  • Adoption of JEDEC Xccela interface for >400MB/s throughput
  • Development of radiation-tolerant devices for LEO satellites
  • Implementation of AI-driven wear-leveling algorithms
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