Memory - Configuration Proms for FPGAs

Image Part Number Description / PDF Quantity Rfq
AT17LV128-10NC

AT17LV128-10NC

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

2529

AT17N512-10PI

AT17N512-10PI

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

395

AT17LV002-10JC

AT17LV002-10JC

Atmel (Microchip Technology)

CONFIG MEMORY, 2MX1, SERIAL

321

AT17LV128-10NI

AT17LV128-10NI

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

10

AT17LV128-10SI

AT17LV128-10SI

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

1345

AT17LV128-10SC

AT17LV128-10SC

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

3172

AT17LV512A-10JI

AT17LV512A-10JI

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

746

AT17F040A-30JC

AT17F040A-30JC

Atmel (Microchip Technology)

CONFIG MEMORY, 4MX1, SERIAL

53

AT17LV512A-10PC

AT17LV512A-10PC

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

720

AT17F040A-30JI

AT17F040A-30JI

Atmel (Microchip Technology)

CONFIG MEMORY, 4MX1, SERIAL

33

AT17F16A-30JC

AT17F16A-30JC

Atmel (Microchip Technology)

CONFIG MEMORY, 16MX1, SERIAL

10

AT17LV65-10JI

AT17LV65-10JI

Atmel (Microchip Technology)

CONFIG MEMORY, 64KX1, SERIAL

2161

AT17LV010-10JC

AT17LV010-10JC

Atmel (Microchip Technology)

CONFIG MEMORY, 1MX1, SERIAL

868

AT17LV010A-10JI

AT17LV010A-10JI

Atmel (Microchip Technology)

CONFIG MEMORY, 1MX1, SERIAL

595

AT17LV512-10JI

AT17LV512-10JI

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

476

AT17LV256-10JI

AT17LV256-10JI

Atmel (Microchip Technology)

CONFIG MEMORY, 256KX1

1171

AT17LV512A-10JC

AT17LV512A-10JC

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

831

AT17LV128-10JI

AT17LV128-10JI

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

507

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
OTP PROMsOne-Time Programmable, low cost, high reliabilityIndustrial control systems
Flash PROMsReprogrammable, high density, moderate endurance5G base stations
EEPROMByte-alterable, high endurance, slower access speedMedical imaging equipment
FRAMLow-power, radiation-hardened, fast write speedAerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

  • Package types: TSSOP, VQFN, BGA
  • Memory array: Floating-gate or antifuse-based technology
  • Interface: SPI, BPI, or parallel bus
  • Voltage rails: 1.2V-3.3V operation with decoupling capacitors
  • Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

ParameterSignificance
Memory density (1Mb-4Gb)Determines maximum FPGA configuration size
Access time (55ns-120ns)Impacts system boot speed
Endurance (10k-100k cycles)Dictates reprogramming lifespan
Data retention (20-100 years)Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)Essential for space applications

5. Application Areas

Primary application domains:

  • Telecommunications: 5G NR base stations, optical transceivers
  • Industrial: Programmable logic controllers (PLCs)
  • Medical: MRI scanners, patient monitoring systems
  • Automotive: ADAS sensor fusion units
  • Defense: Radar signal processing systems

6. Key Manufacturers and Products

ManufacturerProduct SeriesKey Features
MicrochipAT17F Series128Mb SPI interface, -40 C to +125 C
IntelEP180SSecure boot, TSMC 16nm process
XilinxS25FL-VOctal SPI, 400MHz clock rate
CypressFL-S SeriesEnd-to-end data protection

7. Selection Guidelines

Key selection factors:

  • Match memory density to target FPGA's bitstream size
  • Verify interface compatibility (SPI/BPI/parallel)
  • Evaluate environmental requirements (temperature, radiation)
  • Assess security features (encryption, authentication)
  • Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

  • Transition to 3D NAND architecture for densities beyond 8Gb
  • Integration of hardware security modules (HSM)
  • Adoption of JEDEC Xccela interface for >400MB/s throughput
  • Development of radiation-tolerant devices for LEO satellites
  • Implementation of AI-driven wear-leveling algorithms
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