Memory - Batteries

Image Part Number Description / PDF Quantity Rfq
M4Z28-BR00SH1

M4Z28-BR00SH1

STMicroelectronics

IC SNAPHAT BATTERY 48MAH 28-SOIC

89

DS9034PCI+

DS9034PCI+

Maxim Integrated

IC SRAM NV TIMEKEEPING POWERCAP

39

DS9034PCX+

DS9034PCX+

Maxim Integrated

PCM W/CRYSTAL NV SRAM SNAP-ON

821

DS9034I-PCX+

DS9034I-PCX+

Maxim Integrated

IC SRAM NV TIMEKEEPING POWERCAP

136

M4Z32-BR00SH1

M4Z32-BR00SH1

STMicroelectronics

IC SNAPHAT BATTERY 120MAH 28SOIC

510

DS9034PCI

DS9034PCI

Analog Devices, Inc.

DS9034 256K NONVOLATILE SRAM

282

DS9034PC+

DS9034PC+

Maxim Integrated

PCM W/O CRYSTAL NV SRAM SNAP-ON

275

DS90340I-PCX

DS90340I-PCX

Maxim Integrated

IC SRAM NV TIMEKEEPING POWERCAP

0

DS9034PC

DS9034PC

Maxim Integrated

PCM W/O CRYSTAL NV SRAM SNAP-ON

0

DS9034PCX

DS9034PCX

Maxim Integrated

PCM W/CRYSTAL NV SRAM SNAP-ON

0

DS1260-100

DS1260-100

Maxim Integrated

IC SMART BATTERY 3V 16-DIP

0

DS1260-25

DS1260-25

Maxim Integrated

IC SMART BATTERY 250MAH 16-DIP

0

DS1260-50

DS1260-50

Maxim Integrated

IC SMART BATTERY 500MAH 16-DIP

0

Memory - Batteries

1. Overview

Integrated Circuit (IC) Memory refers to semiconductor devices used for data storage in electronic systems, characterized by high-speed access and compact form factors. Batteries are electrochemical energy storage devices providing portable power solutions. Both components are foundational to modern electronics, enabling data retention, system portability, and uninterrupted operation across diverse applications.

2. Main Types & Functional Classification

Type Functional Characteristics Application Examples
DRAM (Dynamic RAM) High-density volatile memory requiring periodic refresh Main memory in PCs/servers
NAND Flash Non-volatile storage with block-level operations SSD storage, USB drives
Lithium-ion Battery High energy density, rechargeable with 3.6-3.7V nominal voltage Smartphones, EVs
SRAM (Static RAM) Fast non-refresh volatile memory with low capacity CPU cache memory
Lithium Primary Battery Non-rechargeable with 3V nominal voltage Medical implants, backup power

3. Structure & Composition

IC Memory typically consists of:

  • Memory cell array with transistor-capacitor pairs (DRAM) or floating-gate transistors (Flash)
  • Address decoding circuitry for cell selection
  • I/O interface and control logic

Batteries generally include:

  • Anode (lithium, graphite) and cathode (LiCoO2, NMC) materials
  • Electrolyte (liquid/gel for ion transport)
  • Separator preventing direct electrode contact

4. Key Technical Specifications

Parameter Importance
Memory Density (GB) Determines data storage capacity
Access Time (ns) Affects system performance speed
Battery Energy Density (Wh/kg) Dictates runtime-to-weight ratio
Charge Cycle Life Measures recharge durability (200-1000+ cycles)
Self-Discharge Rate Impacts shelf life (3-20% per month)

5. Application Fields

  • Consumer Electronics: Smartphone memory/storage, wearable device batteries
  • Automotive: EV battery packs, vehicle infotainment memory
  • Industrial: PLC memory modules, backup power for sensors
  • Aerospace: Satellite memory systems, drone power solutions

6. Leading Manufacturers & Products

Company Product Examples
Samsung Electronics 16Gb LPDDR5 DRAM, 1TB NVMe SSD
Panasonic Energy NCR18650B Li-ion cell (3500mAh)
SK Hynix 8GB GDDR6 graphics memory
Tesla (Battery) 21700 cylindrical battery cell (50kWh pack)

7. Selection Recommendations

  • Memory: Match density/speed to system requirements; consider power consumption (e.g., LPDDR5 for mobile)
  • Batteries: Prioritize energy density for portable devices; evaluate safety certifications (UL, UN38.3)
  • Environmental factors: Operating temperature range (-40 C to 85 C typical)
  • Total Cost of Ownership: Balance initial cost vs cycle life (e.g., LiFePO4 for long-term use)

8. Industry Trends Analysis

Key developments include: 3D NAND stacking enabling 1TB+ memory chips, GDDR6X pushing bandwidth beyond 21Gbps, and solid-state batteries promising 50% higher energy density. Emerging technologies like MRAM (Magnetoresistive RAM) combine non-volatility with DRAM-speed access, while battery innovations in silicon anodes and lithium-metal promise EV ranges exceeding 600 miles per charge. Market forecasts predict the global memory IC market to reach $200B by 2027, with battery demand growing at 14% CAGR through 2030 driven by EV adoption.

RFQ BOM Call Skype Email
Top