Memory

Part Number	Description / PDF	Quantity
IS43LR32100D-6BL-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 32MBIT PARALLEL 90TFBGA	0
IS42S32160F-6TL-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 512MBIT PAR 86TSOP II	0
IS43TR16128CL-15HBL-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 2GBIT PARALLEL 96TWBGA	0
IS43R16160F-5TLI-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 256MBIT PAR 66TSOP II	0
IS43LR16320C-6BLI-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 512MBIT PARALLEL 60TFBGA	0
IS46LR16320C-6BLA2 ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 512MBIT PARALLEL 60TFBGA	0
IS46TR16128CL-15HBLA1 ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 2GBIT PARALLEL 96TWBGA	0
IS43DR81280B-25DBL ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 1GBIT PARALLEL 60TWBGA	0
IS62WV51216ALL-70BLI-TR ISSI (Integrated Silicon Solution, Inc.)	IC SRAM 8MBIT PARALLEL 48MINIBGA	0
IS42S32200L-6TLI-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 64MBIT PAR 86TSOP II	0
IS42VM32100D-6BLI ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 32MBIT PARALLEL 90TFBGA	0
IS65C1024AL-45TLA3-TR ISSI (Integrated Silicon Solution, Inc.)	IC SRAM 1MBIT PARALLEL 32TSOP I	0
IS46R16160D-5TLA1 ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 256MBIT PAR 66TSOP II	0
IS42S16100H-7TLI-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 16MBIT PAR 50TSOP II	4137
IS42RM32800K-75BLI-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 256MBIT PARALLEL 90TFBGA	0
IS61LPS25636A-200TQLI-TR ISSI (Integrated Silicon Solution, Inc.)	IC SRAM 9MBIT PARALLEL 100TQFP	0
IS42S86400D-7TL-TR ISSI (Integrated Silicon Solution, Inc.)	IC DRAM 512MBIT PAR 54TSOP II	0
IS61LF51236B-7.5B3LI ISSI (Integrated Silicon Solution, Inc.)	IC SRAM 18MBIT PARALLEL 165TFBGA	0
IS64WV102416BLL-10CTLA3 ISSI (Integrated Silicon Solution, Inc.)	IC SRAM 16MBIT PARALLEL 48TSOP I	0
IS61VPS102436B-250B3L-TR ISSI (Integrated Silicon Solution, Inc.)	IC SRAM 36MBIT PARALLEL 165TFBGA	0

Memory

1. Overview

Memory integrated circuits (ICs) are semiconductor devices used for storing digital data in electronic systems. As fundamental components of modern electronics, they enable data retention and retrieval in computers, mobile devices, industrial equipment, and automotive systems. Memory ICs are categorized into volatile (requires power to retain data) and non-volatile (retains data without power) types, playing critical roles in system performance, storage capacity, and energy efficiency.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
DRAM (Dynamic RAM)	High-density, low-cost, requires periodic refresh	PCs, Servers, Graphics Cards
NAND Flash	Non-volatile, high endurance, block-level access	SSDs, USB Drives, Mobile Storage
SRAM (Static RAM)	High-speed, low density, no refresh required	Cache Memory, Networking Equipment
NOR Flash	Random access, execute-in-place capability	Embedded Systems, Automotive ECUs
MRAM (Magnetoresistive RAM)	Non-volatile, unlimited endurance, low power	IoT Devices, Industrial Sensors

3. Structure and Composition

Memory ICs typically consist of:

Storage Cell Array: Matrix of memory cells (transistors/capacitors for DRAM, floating-gate transistors for Flash)
Address Decoder: Selects specific memory locations
I/O Circuits: Data input/output interfaces
Control Logic: Manages read/write operations and timing
Power Management Units: Optimizes energy consumption

Advanced packages include BGA (Ball Grid Array) and 3D-stacked configurations for density optimization.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	Data volume (Gb/GiB)	Determines system memory limits
Access Time	ns/predictable latency	Impacts processing speed
Power Consumption	mW/MHz	Affects battery life and thermal design
Endurance	P/E cycles (Flash)	Dictates product lifespan
Data Retention	Years (non-volatile)	Critical for long-term storage

5. Application Areas

Consumer Electronics: Smartphones (NAND Flash), Gaming Consoles (GDDR6)
Industrial Automation: PLCs (SRAM), Data Loggers (MRAM)
Automotive Systems: ADAS (LPDDR5), Infotainment (eMMC)
Enterprise Storage: SSD Controllers (3D NAND), Servers (RDIMM)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Samsung Electronics	V-NAND (9x-layer), LPDDR5X
SK hynix	HBM3 (8GB/s bandwidth), GDDR6
Microchip Technology	Serial NOR Flash (SST26)
Kioxia Corporation	BiCS FLASH (3D NAND)
Infineon Technologies	MRAM (40nm process)

7. Selection Recommendations

Key considerations:

Match memory type to application requirements (e.g., NOR Flash for code storage)
Evaluate bandwidth vs. latency tradeoffs
Analyze temperature and vibration specifications
Assess long-term supply stability
Optimize cost-per-bit metrics

Case Study: A smartphone manufacturer selected UFS 3.1 (NAND-based) for 2100MB/s read speeds, improving app launch times by 35%.

8. Industry Trends

Future directions include:

3D NAND scaling beyond 200 layers
Emerging memories (ReRAM, PCM) for AI acceleration
Package-on-Package (PoP) integration
AI-optimized memory architectures (Processing-in-Memory)
Green manufacturing processes (EUV lithography)