Memory

Part Number	Description / PDF	Quantity
NDT18PFH-9MET Insignis Technology Corporation	IC DRAM 1GBIT PARALLEL 78FBGA	0
NDS73PT9-16IT Insignis Technology Corporation	IC DRAM 128MBIT PAR 86TSOP II	2
NSEC00K016-IT Insignis Technology Corporation	IC FLASH 128GBIT EMMC 100BGA	0
NDS76PT5-20IT Insignis Technology Corporation	IC DRAM 128MBIT PAR 54TSOP II	22
NDD36PT6-2AIT Insignis Technology Corporation	IC DRAM 256MBIT PAR 66TSOP II	0
NDS76PT5-16IT Insignis Technology Corporation	IC DRAM 128MBIT PAR 54TSOP II	120
NDL46PFP-9MIT Insignis Technology Corporation	IC DRAM 4GBIT PARALLEL 96FBGA	231
NDS96PT4-16IT Insignis Technology Corporation	IC DRAM 16MBIT PAR 50TSOP II	0
NDD56PT6-2AIT Insignis Technology Corporation	IC DRAM 512MBIT PAR 66TSOP II	6
NDT16PFJ-8KIT Insignis Technology Corporation	IC DRAM 1GBIT PARALLEL 96FBGA	972
NDL26PFG-8KIT Insignis Technology Corporation	IC DRAM 2GBIT PARALLEL 96FBGA	894
NDS73PT9-16ET Insignis Technology Corporation	IC DRAM 128MBIT PAR 86TSOP II	90
NDB16PFC-4DIT Insignis Technology Corporation	IC DRAM 1GBIT PARALLEL 84FBGA	611

Memory

1. Overview

Memory integrated circuits (ICs) are semiconductor devices used for storing digital data in electronic systems. As fundamental components of modern electronics, they enable data retention and retrieval in computers, mobile devices, industrial equipment, and automotive systems. Memory ICs are categorized into volatile (requires power to retain data) and non-volatile (retains data without power) types, playing critical roles in system performance, storage capacity, and energy efficiency.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
DRAM (Dynamic RAM)	High-density, low-cost, requires periodic refresh	PCs, Servers, Graphics Cards
NAND Flash	Non-volatile, high endurance, block-level access	SSDs, USB Drives, Mobile Storage
SRAM (Static RAM)	High-speed, low density, no refresh required	Cache Memory, Networking Equipment
NOR Flash	Random access, execute-in-place capability	Embedded Systems, Automotive ECUs
MRAM (Magnetoresistive RAM)	Non-volatile, unlimited endurance, low power	IoT Devices, Industrial Sensors

3. Structure and Composition

Memory ICs typically consist of:

Storage Cell Array: Matrix of memory cells (transistors/capacitors for DRAM, floating-gate transistors for Flash)
Address Decoder: Selects specific memory locations
I/O Circuits: Data input/output interfaces
Control Logic: Manages read/write operations and timing
Power Management Units: Optimizes energy consumption

Advanced packages include BGA (Ball Grid Array) and 3D-stacked configurations for density optimization.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	Data volume (Gb/GiB)	Determines system memory limits
Access Time	ns/predictable latency	Impacts processing speed
Power Consumption	mW/MHz	Affects battery life and thermal design
Endurance	P/E cycles (Flash)	Dictates product lifespan
Data Retention	Years (non-volatile)	Critical for long-term storage

5. Application Areas

Consumer Electronics: Smartphones (NAND Flash), Gaming Consoles (GDDR6)
Industrial Automation: PLCs (SRAM), Data Loggers (MRAM)
Automotive Systems: ADAS (LPDDR5), Infotainment (eMMC)
Enterprise Storage: SSD Controllers (3D NAND), Servers (RDIMM)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Samsung Electronics	V-NAND (9x-layer), LPDDR5X
SK hynix	HBM3 (8GB/s bandwidth), GDDR6
Microchip Technology	Serial NOR Flash (SST26)
Kioxia Corporation	BiCS FLASH (3D NAND)
Infineon Technologies	MRAM (40nm process)

7. Selection Recommendations

Key considerations:

Match memory type to application requirements (e.g., NOR Flash for code storage)
Evaluate bandwidth vs. latency tradeoffs
Analyze temperature and vibration specifications
Assess long-term supply stability
Optimize cost-per-bit metrics

Case Study: A smartphone manufacturer selected UFS 3.1 (NAND-based) for 2100MB/s read speeds, improving app launch times by 35%.

8. Industry Trends

Future directions include:

3D NAND scaling beyond 200 layers
Emerging memories (ReRAM, PCM) for AI acceleration
Package-on-Package (PoP) integration
AI-optimized memory architectures (Processing-in-Memory)
Green manufacturing processes (EUV lithography)