Memory

Part Number	Description / PDF	Quantity
S25FL256LAGBHV020 Cypress Semiconductor	IC FLASH 256MBIT SPI/QUAD 24BGA	674
S25FL128SAGMFN000 Cypress Semiconductor	IC FLASH 128MBIT SPI/QUAD 16SOIC	0
CY14E116L-ZS25XIT Cypress Semiconductor	IC NVSRAM 16MBIT PAR 44TSOP II	0
CY7C1061GN30-10ZXI Cypress Semiconductor	IC SRAM 16MBIT PARALLEL 48TSOP I	0
S25FL128SAGBHIS03 Cypress Semiconductor	IC FLASH 128MBIT SPI/QUAD 24BGA	0
S25FS256SAGBHI303 Cypress Semiconductor	IC FLASH 256MBIT SPI/QUAD 24BGA	0
CY7C1061G18-15BVJXIT Cypress Semiconductor	IC SRAM 16MBIT PARALLEL 48VFBGA	0
CY7C1069GN30-10BVXI Cypress Semiconductor	IC SRAM 16MBIT PARALLEL 48VFBGA	0
S25FL256SAGBHIT00 Cypress Semiconductor	IC FLASH 256MBIT SPI/QUAD 24BGA	0
S29GL256S90FHI023 Cypress Semiconductor	IC FLASH 256MBIT PARALLEL 64FBGA	0
CY14B101Q2A-SXIT Cypress Semiconductor	IC NVSRAM 1MBIT SPI 40MHZ 8SOIC	0
CY62158H-45ZSXIT Cypress Semiconductor	IC SRAM 8MBIT PARALLEL 44TSOP II	0
CY62157ELL-55ZSXET Cypress Semiconductor	IC SRAM 8MBIT PARALLEL 44TSOP II	0
S29GL256S90TFA020 Cypress Semiconductor	IC FLASH 256MBIT PARALLEL 56TSOP	0
CY62158EV30LL-45ZSXI Cypress Semiconductor	IC SRAM 8MBIT PARALLEL 44TSOP II	993
CY7C1061GN18-15ZSXI Cypress Semiconductor	IC SRAM 16MBIT PAR 54TSOP II	0
CY62162G18-55BGXIT Cypress Semiconductor	IC SRAM 16MBIT PARALLEL 119PBGA	0
S29GL064N11FFIS13 Cypress Semiconductor	IC FLASH 64MBIT PARALLEL 64FBGA	0
S29GL01GS10DHSS30 Cypress Semiconductor	IC FLASH 1GBIT PARALLEL 64FBGA	0
S25FL064LABBHN023 Cypress Semiconductor	IC FLASH 64MBIT SPI/QUAD 24BGA	0

Memory

1. Overview

Memory integrated circuits (ICs) are semiconductor devices used for storing digital data in electronic systems. As fundamental components of modern electronics, they enable data retention and retrieval in computers, mobile devices, industrial equipment, and automotive systems. Memory ICs are categorized into volatile (requires power to retain data) and non-volatile (retains data without power) types, playing critical roles in system performance, storage capacity, and energy efficiency.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
DRAM (Dynamic RAM)	High-density, low-cost, requires periodic refresh	PCs, Servers, Graphics Cards
NAND Flash	Non-volatile, high endurance, block-level access	SSDs, USB Drives, Mobile Storage
SRAM (Static RAM)	High-speed, low density, no refresh required	Cache Memory, Networking Equipment
NOR Flash	Random access, execute-in-place capability	Embedded Systems, Automotive ECUs
MRAM (Magnetoresistive RAM)	Non-volatile, unlimited endurance, low power	IoT Devices, Industrial Sensors

3. Structure and Composition

Memory ICs typically consist of:

Storage Cell Array: Matrix of memory cells (transistors/capacitors for DRAM, floating-gate transistors for Flash)
Address Decoder: Selects specific memory locations
I/O Circuits: Data input/output interfaces
Control Logic: Manages read/write operations and timing
Power Management Units: Optimizes energy consumption

Advanced packages include BGA (Ball Grid Array) and 3D-stacked configurations for density optimization.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	Data volume (Gb/GiB)	Determines system memory limits
Access Time	ns/predictable latency	Impacts processing speed
Power Consumption	mW/MHz	Affects battery life and thermal design
Endurance	P/E cycles (Flash)	Dictates product lifespan
Data Retention	Years (non-volatile)	Critical for long-term storage

5. Application Areas

Consumer Electronics: Smartphones (NAND Flash), Gaming Consoles (GDDR6)
Industrial Automation: PLCs (SRAM), Data Loggers (MRAM)
Automotive Systems: ADAS (LPDDR5), Infotainment (eMMC)
Enterprise Storage: SSD Controllers (3D NAND), Servers (RDIMM)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Samsung Electronics	V-NAND (9x-layer), LPDDR5X
SK hynix	HBM3 (8GB/s bandwidth), GDDR6
Microchip Technology	Serial NOR Flash (SST26)
Kioxia Corporation	BiCS FLASH (3D NAND)
Infineon Technologies	MRAM (40nm process)

7. Selection Recommendations

Key considerations:

Match memory type to application requirements (e.g., NOR Flash for code storage)
Evaluate bandwidth vs. latency tradeoffs
Analyze temperature and vibration specifications
Assess long-term supply stability
Optimize cost-per-bit metrics

Case Study: A smartphone manufacturer selected UFS 3.1 (NAND-based) for 2100MB/s read speeds, improving app launch times by 35%.

8. Industry Trends

Future directions include:

3D NAND scaling beyond 200 layers
Emerging memories (ReRAM, PCM) for AI acceleration
Package-on-Package (PoP) integration
AI-optimized memory architectures (Processing-in-Memory)
Green manufacturing processes (EUV lithography)