Logic - Universal Bus Functions

Image Part Number Description / PDF Quantity Rfq
GTLP10B320MTDX

GTLP10B320MTDX

REGISTERED BUS TRANSCEIVER

1910

SN74GTLPH16612GR

SN74GTLPH16612GR

Texas Instruments

REGISTERED BUS TRANSCEIVER

71450

SN74ABT16500BDLG4

SN74ABT16500BDLG4

Texas Instruments

IC UNIV BUS TXRX 18BIT 56SSOP

0

74ALVCH162601DGGY

74ALVCH162601DGGY

Nexperia

IC UNIV BUS TXRX 18BIT 56TSSOP

0

SN74ALVCH16524DLR

SN74ALVCH16524DLR

Texas Instruments

REGISTERED BUS TRANSCEIVER

8000

NTE74HC299

NTE74HC299

NTE Electronics, Inc.

IC-HI SPEED CMOS REGISTER

162

74ALVCH16601DGGY

74ALVCH16601DGGY

Nexperia

IC UNIV BUS TXRX 18BIT 56TSSOP

0

SN74ALVCH16500DL

SN74ALVCH16500DL

Texas Instruments

REGISTERED BUS TRANSCEIVER

5935

ADG804YRM-REEL

ADG804YRM-REEL

Analog Devices, Inc.

4-CHANNEL MULTIPLEXER

0

MAX3408EUK+T

MAX3408EUK+T

Analog Devices, Inc.

TERMINATOR, 1-LINE, 120OHM, BICM

2500

SN74ALVCH16269DGGR

SN74ALVCH16269DGGR

Texas Instruments

SN74ALVCH16269 12-BIT TO 24-BIT

28461

SN74ALVCHR16409GR

SN74ALVCHR16409GR

Texas Instruments

BUS EXCHANGER, ALVC/VCX/A SERIES

2000

SN74ABTH18502APMR

SN74ABTH18502APMR

Texas Instruments

SN74ABTH18502A SCAN TEST DEVICES

4000

SN74ABT162601DLR

SN74ABT162601DLR

Texas Instruments

SN74ABT162601 18-BIT UNIVERSAL B

61765

74ABT16500CSSCX

74ABT16500CSSCX

BUS TRANSCEIVER, ABT SERIES

2000

CY74FCT16501ATPVC

CY74FCT16501ATPVC

Texas Instruments

IC UNIV BUS TXRX 18BIT 56SSOP

360

SN74ALVC162836DL

SN74ALVC162836DL

Texas Instruments

SN74ALVC162836 20-BIT UNIVERSAL

30573

SN74ALVCH162334DLR

SN74ALVCH162334DLR

Texas Instruments

BUS DRIVER

18000

SN74LVT16500DL

SN74LVT16500DL

Texas Instruments

REGISTERED BUS TRANSCEIVER

4286

GTLP16612MTDX

GTLP16612MTDX

REGISTERED BUS TRANSCEIVER

51750

Logic - Universal Bus Functions

1. Overview

Universal Bus Function ICs are logic devices designed to manage data transfer between different components in electronic systems. They provide critical interface capabilities for voltage level translation, signal buffering, bus arbitration, and protocol conversion. These ICs are essential in modern electronics for enabling compatibility between devices with different electrical and logical characteristics.

2. Major Types and Functional Classification

Type Functional Characteristics Application Examples
Bus Transceivers Dual-directional data transfer with 3-state I/O ports Memory interfaces, PCI Express buses
Bus Buffers Signal amplification and isolation Industrial control backplanes
Level Translators Voltage conversion between 1.2V-5V domains Multivoltage SoC interfaces
Bus Controllers Protocol management and arbitration logic USB host controllers, CAN bus systems

3. Structure and Composition

Typical physical structure includes:

  • Plastic/ceramic package (TSSOP, QFN, BGA variants)
  • Multiple channel configurations (4/8/16-bit)
  • Internal components: logic gates, buffer amplifiers, clamping diodes
  • ESD protection structures on I/O pins
  • Power rails with decoupling capacitors

4. Key Technical Specifications

Parameter Significance
Voltage Range (1.2V-5.5V) Defines compatibility with host systems
Data Rate (up to 500Mbps) Determines maximum bus throughput
Drive Strength ( 24mA) Affects signal integrity over long traces
Propagation Delay (<2ns) Critical for timing-sensitive applications
ESD Rating ( 8kV HBM) Reliability indicator in industrial environments

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical modules)
  • Automotive (CAN-FD interfaces, ADAS systems)
  • Industrial Automation (PLC backplanes, motor controllers)
  • Consumer Electronics (smartphones, SSD interfaces)

6. Leading Manufacturers and Products

Manufacturer Product Series Key Features
TI SN74LVC16T245 1.2V-3.6V operation, 64-pin TSSOP
NXP 74ALVC164245 2.3V-3.6V, 24mA drive current
STMicro LVC1G125 Single-channel buffer in SOT23-5
Intel I3TBUF0242 1.7V-5.5V, hot-swap capability

7. Selection Recommendations

Key considerations:

  • Voltage compatibility with existing bus standards
  • Required data bandwidth and timing margins
  • Package size constraints (BGA vs TSSOP)
  • Temperature rating for industrial/military use
  • Cost vs. integrated features trade-off

8. Industry Trends

Current development directions include:

  • Migration to 10+ Gbps data rates for 5G applications
  • Integration with protocol-specific accelerators
  • Adoption of advanced packaging (3D stacking)
  • Enhanced EMI reduction techniques
  • Support for emerging standards like CXL and UCIe
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