Logic - Translators, Level Shifters

Part Number	Description / PDF	Quantity
MAX30132CWA+ Maxim Integrated	IC REG LDO BUCK SMD	398
MAX30134EWA+ Maxim Integrated	INTEGRATED CIRCUIT	0
MAX3373EEKA+TG104 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX9378EUA/GG8 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX30134CWA+ Maxim Integrated	IC REG LDO BUCK SMD	0
MAX9370EKA+T Maxim Integrated	IC POWER MANAGEMENT	0
MAX3373EEKA+G104 Maxim Integrated	IC TRANSLATOR BIDIR SOT23-8	0
MAX9370EKA+ Maxim Integrated	IC POWER MANAGEMENT	0
MAX3378EETD+G05 Maxim Integrated	IC TRANSLATOR BIDIR SOT23-8	0
MAX3373EEKA+TG11 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX30131CWA+T Maxim Integrated	IC REG LDO BUCK SMD	8000
MAX6618AUB+G126 Maxim Integrated	PECI-TO-TRANSLATOR	0
MAX3006EUP+T Maxim Integrated	+1.2V TO +5.5V, 15KV ESD-PROTECT	0
MAX3371ELT+ Maxim Integrated	IC TRANSLATOR BIDIRECT 6UDFN	0
MAX14695EWE+T Maxim Integrated	6-CHANNEL HIGH SPEED SDIO LOGIC	0

Logic - Translators, Level Shifters

1. Overview

Logic translators and level shifters are semiconductor devices that enable signal compatibility between circuits operating at different voltage levels. These ICs ensure reliable data transmission by converting logic signals from one voltage domain to another, maintaining signal integrity in mixed-voltage systems. Their importance has grown with the proliferation of low-voltage CMOS technologies and multi-rail power architectures in modern electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-direction translators	Unidirectional voltage conversion with isolation	SPI interface between 3.3V FPGA and 1.8V sensors
Bi-directional translators	Automatic direction detection, dual-voltage I/O	I2C bus bridging between 5V microcontroller and 2.5V EEPROM
Multi-channel level shifters	Parallel conversion of multiple signals (4-32 channels)	Memory interface between SoC and DDR4 SDRAM modules
Direction-controlled translators	External control pin for signal direction selection	UART level conversion in industrial communication modules

3. Structure and Composition

Typical devices feature a monolithic CMOS structure with dual power supply inputs (VCCA and VCCB). Physical components include:

Dual-supply MOSFET pairs for voltage translation
Integrated clamp circuits for ESD protection
Direction control logic (for bidirectional types)
Channel-specific enable/disable circuitry

Common package types: TSSOP (14-48 pins), QFN (20-64 pins), WLCSP (1.5 1.5mm ultra-compact).

4. Key Technical Specifications

Parameter	Significance
Voltage range (1.2V-5.5V)	Determines compatibility with different logic families
Conversion rate (100Mbps-1.2Gbps)	Limits maximum operating frequency
Channel count (1-32)	Impacts system integration density
Propagation delay (2-20ns)	Affects timing critical applications
Quiescent current (1-100 A)	Power efficiency in battery-powered systems

5. Application Areas

Key industries include:

Telecommunications: 5G baseband processors interfacing with RF front-ends
Industrial automation: PLC modules connecting 24V sensors to 3.3V MCUs
Consumer electronics: Smartphone PMIC to application processor communication
Automotive systems: CAN-FD transceiver voltage adaptation
IoT devices: Sensor hub interfacing between different voltage rail components

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	TXB0108	8-channel, 1.2-3.6V to 1.65-5.5V translation, auto-direction detection
NXP Semiconductors	LTC2850	3.3/5V dual supply, 15kV ESD protection, RS485/UART interface
ON Semiconductor	NXU408	4-channel, 0.9-5.5V range, sub-1ns propagation delay
STMicroelectronics	L6470	Stepper motor driver with integrated level shifting for industrial automation

7. Selection Guidelines

Key considerations:

Match supply voltage ranges with source/target systems
Ensure conversion rate meets timing requirements
Choose appropriate channel density to minimize PCB area
For bidirectional buses, select devices with automatic direction sensing
Consider thermal performance for high-current applications
Evaluate ESD protection levels for industrial environments

8. Industry Trends

Development directions include:

Voltage scaling down to 0.8V core operation
Integration with signal conditioning functions
Increased adoption of capacitive isolation technology
Advanced packaging (3D TSV, fan-out WLP)
Protocol-aware smart translation (I3C, PCIe 6.0)