Logic - Translators, Level Shifters

Part Number	Description / PDF	Quantity
NVT2006PW,118 NXP Semiconductors	IC TRNSLTR BIDIRECTIONAL 16TSSOP	3354
TXB0101DCKTG4 Texas Instruments	IC TRNSLTR BIDIRECTIONAL SC70-6	0
NB6L16DTG	LOW SKEW CLOCK DRIVER, 6L SERIES	0
MAX3003EBP-T Analog Devices, Inc.	8-CH LEVEL TRANSLATOR	2500
SN10KHT5578NT Texas Instruments	TTL TO ECL TRANSLATOR	12556
TPS65680RSNT Texas Instruments	IC TRNSLTR BIDIRECTIONAL 32WQFN	250
MAX3023EBC+T Analog Devices, Inc.	QUAD-LEVEL TRANSLATOR	12340
MC100ELT25DG Sanyo Semiconductor/ON Semiconductor	IC TRNSLTR UNIDIRECTIONAL 8SOIC	184
GTL2002D/DG,118 NXP Semiconductors	IC XLATR 2BIT BI-DIREC 8-SOIC	2974
ISL3034EIRTZ-T Intersil (Renesas Electronics America)	IC TRNSLTR BIDIRECTIONAL 16TQFN	4147
MAX13003EEUE+T Maxim Integrated	IC TRNSLTR BIDIRECTIONAL 16TSSOP	0
PI6ULS5V9306WEX Zetex Semiconductors (Diodes Inc.)	IC TRNSLTR BIDIRECTIONAL 8SOIC	0
MC10H350FNG	QUAD PECL TO TTL TRANSLATOR, TRU	38
MC100EL91DWR2	PECL TO ECL TRANSLATOR	1000
MC10ELT24D	TTL TO ECL TRANSLATOR	9060
TXB0104RGYRG4 Texas Instruments	IC TRNSLTR BIDIRECTIONAL 14VQFN	0
MC100ELT21D	PECL TO TTL TRANSLATOR	1902
74AUP1T98GW-Q100H Nexperia	IC LP CONFIG GATE V-XLATR	0
SN74GTLP1395PWR Texas Instruments	SN74GTLP1395 TWO 1-BIT LVTTL/GTL	19933
100391SC	TTL TO ECL TRANSLATOR	1727

Logic - Translators, Level Shifters

1. Overview

Logic translators and level shifters are semiconductor devices that enable signal compatibility between circuits operating at different voltage levels. These ICs ensure reliable data transmission by converting logic signals from one voltage domain to another, maintaining signal integrity in mixed-voltage systems. Their importance has grown with the proliferation of low-voltage CMOS technologies and multi-rail power architectures in modern electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-direction translators	Unidirectional voltage conversion with isolation	SPI interface between 3.3V FPGA and 1.8V sensors
Bi-directional translators	Automatic direction detection, dual-voltage I/O	I2C bus bridging between 5V microcontroller and 2.5V EEPROM
Multi-channel level shifters	Parallel conversion of multiple signals (4-32 channels)	Memory interface between SoC and DDR4 SDRAM modules
Direction-controlled translators	External control pin for signal direction selection	UART level conversion in industrial communication modules

3. Structure and Composition

Typical devices feature a monolithic CMOS structure with dual power supply inputs (VCCA and VCCB). Physical components include:

Dual-supply MOSFET pairs for voltage translation
Integrated clamp circuits for ESD protection
Direction control logic (for bidirectional types)
Channel-specific enable/disable circuitry

Common package types: TSSOP (14-48 pins), QFN (20-64 pins), WLCSP (1.5 1.5mm ultra-compact).

4. Key Technical Specifications

Parameter	Significance
Voltage range (1.2V-5.5V)	Determines compatibility with different logic families
Conversion rate (100Mbps-1.2Gbps)	Limits maximum operating frequency
Channel count (1-32)	Impacts system integration density
Propagation delay (2-20ns)	Affects timing critical applications
Quiescent current (1-100 A)	Power efficiency in battery-powered systems

5. Application Areas

Key industries include:

Telecommunications: 5G baseband processors interfacing with RF front-ends
Industrial automation: PLC modules connecting 24V sensors to 3.3V MCUs
Consumer electronics: Smartphone PMIC to application processor communication
Automotive systems: CAN-FD transceiver voltage adaptation
IoT devices: Sensor hub interfacing between different voltage rail components

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	TXB0108	8-channel, 1.2-3.6V to 1.65-5.5V translation, auto-direction detection
NXP Semiconductors	LTC2850	3.3/5V dual supply, 15kV ESD protection, RS485/UART interface
ON Semiconductor	NXU408	4-channel, 0.9-5.5V range, sub-1ns propagation delay
STMicroelectronics	L6470	Stepper motor driver with integrated level shifting for industrial automation

7. Selection Guidelines

Key considerations:

Match supply voltage ranges with source/target systems
Ensure conversion rate meets timing requirements
Choose appropriate channel density to minimize PCB area
For bidirectional buses, select devices with automatic direction sensing
Consider thermal performance for high-current applications
Evaluate ESD protection levels for industrial environments

8. Industry Trends

Development directions include:

Voltage scaling down to 0.8V core operation
Integration with signal conditioning functions
Increased adoption of capacitive isolation technology
Advanced packaging (3D TSV, fan-out WLP)
Protocol-aware smart translation (I3C, PCIe 6.0)