Logic - Signal Switches, Multiplexers, Decoders

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IC MULTIPLEXER 6 X 2:1 28PLCC

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IC MULTIPLEXER 1 X 2:1 8SOIC

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IC MULTIPLEXER 1 X 2:1 8SOIC

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IC MULTIPLEXER 1 X 2:1 8SOIC

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IC MULTIPLEXER 1 X 8:1 28PLCC

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IC MULTIPLEXER 1 X 2:1 8SOIC

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IC MULTIPLEXER 1 X 8:1 44MLF

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IC CROSSPOINT SW 1 X 2:2 16QSOP

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IC MULTIPLEX 1 X 16:1 24CERPACK

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IC MULTIPLEXER 1 X 16:1 28PLCC

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SY100S364JZ-TR

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IC MULTIPLEXER 1 X 16:1 28PLCC

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SY100EL58ZG-TR

Roving Networks / Microchip Technology

IC MULTIPLEXER 1 X 2:1 8SOIC

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IC MULTIPLEXER 1 X 2:1 32MLF

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SY100E164JZ-TR

SY100E164JZ-TR

Roving Networks / Microchip Technology

IC MULTIPLEXER 1 X 16:1 28PLCC

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SY100E154JZ

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IC MULTIPLEXER 5 X 2:1 28PLCC

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SY100E457JZ-TR

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IC MULTIPLEXER 3 X 2:1 28PLCC

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SY10E167JC-TR

SY10E167JC-TR

Roving Networks / Microchip Technology

IC MULTIPLEXER 6 X 2:1 28PLCC

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Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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