Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
PEX8734-AB80BI G

PEX8734-AB80BI G

Broadcom

IC PCIE SWITCH 676FCBGA

361

BCM56162B0KFSBG

BCM56162B0KFSBG

Broadcom

IC ETHERNET SWITCH BGA

0

BCM88270CA1IFSBG

BCM88270CA1IFSBG

Broadcom

120 GB CENTRALIZED SWITCH

0

BCM56170B0IFSBG

BCM56170B0IFSBG

Broadcom

24X10G L3 TSN SWITCH

0

BCM88376CB0KFSBG

BCM88376CB0KFSBG

Broadcom

MESH B0 SKU

0

BCM56970B0KFSBG

BCM56970B0KFSBG

Broadcom

B0 REVISION OF TOMAHAWK2

0

BCM56845A4KFRBLG

BCM56845A4KFRBLG

Broadcom

MULTI LAYER SWITCH

0

BCM56762B0KFSBG

BCM56762B0KFSBG

Broadcom

480G 10GBE/40GBE/100GBE MULTILAY

0

BCM56768B0KFSBG

BCM56768B0KFSBG

Broadcom

10/25/40/100GE CAPABLE MULTILAYE

0

BCM88272CA1KFSBG

BCM88272CA1KFSBG

Broadcom

64 GBE SWITCH WITH INTEGRATED TM

0

BCM88682CA1KFSBG

BCM88682CA1KFSBG

Broadcom

FULL NIF, NO ELPM

0

BCM56160B0IFSBG

BCM56160B0IFSBG

Broadcom

IC ETHERNET SWITCH BGA

0

BCM56965A1KFSBG

BCM56965A1KFSBG

Broadcom

3.2TB DATA CENTER SWITCH WITH CL

0

BCM88775A1KFSBG

BCM88775A1KFSBG

Broadcom

144 SERDES SINGLE STAGE

0

BCM56873A0KFSBG

BCM56873A0KFSBG

Broadcom

2.0T 20X100GBE MULTILAYER SWITCH

0

BCM56174B0KFSBG

BCM56174B0KFSBG

Broadcom

16X10G OR 24X1G L3 SWITCH

0

BCM56744A1KFTBLG

BCM56744A1KFTBLG

Broadcom

MULTI LAYER SWITCH

0

BCM88650B1KFSBLG

BCM88650B1KFSBLG

Broadcom

TRAFFIC MGR + PACKETPROC

0

BCM56065A0KFSBG

BCM56065A0KFSBG

Broadcom

16-PORT 2.5GE MANAGED SWITCH +

0

BCM88279CA1KFSBG

BCM88279CA1KFSBG

Broadcom

120 GBE SWITCH WITH INTEGRATED T

0

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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