Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
CD74HC237EG4

CD74HC237EG4

Texas Instruments

IC DECODER/DEMUX 1X3:8 16DIP

0

TS5N118DBQR

TS5N118DBQR

Texas Instruments

IC MUX/DEMUX 1 X 8:1 16SSOP

0

CD54HC154F3A

CD54HC154F3A

Texas Instruments

CD54HC154 HIGH SPEED CMOS LOGIC

4

74CBTLV3245ADWG4

74CBTLV3245ADWG4

Texas Instruments

IC BUS SWITCH 8 X 1:1 20SOIC

0

4016BDC

4016BDC

MULTIPLEXERS/SWITCHES

4470

MAX6512UT045-T

MAX6512UT045-T

Analog Devices, Inc.

REMOTE TEMPERATURE SWITCH

2500

74HC238D-Q100118

74HC238D-Q100118

NXP Semiconductors

DECODER/DRIVER, HC/UH SERIES

6690

ADN4612ACPZ

ADN4612ACPZ

Analog Devices, Inc.

IC CROSSPOINT SW 1X12:12 88LFCSP

239

CD74HCT251M

CD74HCT251M

Texas Instruments

IC MULTIPLEXER 1 X 8:1 16SOIC

1169

QS3VH862QG8

QS3VH862QG8

Renesas Electronics America

IC BUS SWITCH 10 X 1:1 24QSOP

0

FST16209MEA

FST16209MEA

BUS EXCHANGER

5626

SN65LVDT122PW

SN65LVDT122PW

Texas Instruments

IC CROSSPOINT SW 1 X 2:2 16TSSOP

630

PI3B3253QEX

PI3B3253QEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 2 X 4:1 16QSOP

1787

QS74FCT2153ATSO

QS74FCT2153ATSO

MUX, FCT SERIES

3191

74LV138D,118

74LV138D,118

Nexperia

IC DECODER/DEMUX 1 X 3:8 16SO

0

SN74LV157ADGVR

SN74LV157ADGVR

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16TVSOP

44000

74AXP1G157GN125

74AXP1G157GN125

NXP Semiconductors

MUX, AXP SERIES

0

CD74HC157EX

CD74HC157EX

QUAD 2-INPUT MUX

0

74S153PC

74S153PC

MUX, 2-FUNC, 4 LINE INPUT, TTL

7984

AD8153ACPZ-RL7

AD8153ACPZ-RL7

Analog Devices, Inc.

IC MUX/DEMUX 1 X 2:1 32LFCSP

0

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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