Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
HI1-5045-7

HI1-5045-7

DPST ANALOG SWITCH

193

SN74LS157M

SN74LS157M

MULTIPLEXER, LS SERIES TTL

1378

74AC11257DWR

74AC11257DWR

Texas Instruments

IC MULTIPLEXER 4 X 2:1 20SOIC

12000

DS90CP02SP/NOPB

DS90CP02SP/NOPB

IC CROSSPOINT SW 1 X 2:2 28WQFN

3830

74F139PC

74F139PC

IC DECODER/DEMUX 1X2:4 16DIP

10584

CD4515BM96

CD4515BM96

Texas Instruments

IC DECODER/DEMUX 1X4:16 24SOIC

8050

SN74CB3Q3257PWRG4

SN74CB3Q3257PWRG4

Texas Instruments

IC MUX/DEMUX 4 X 2:1 16TSSOP

1596

DM74ALS253M

DM74ALS253M

IC MULTIPLEXER 2 X 4:1 16SOIC

2880

SN74HCT139DT

SN74HCT139DT

Texas Instruments

IC DECODER/DEMUX 1X2:4 16SOIC

4750

74CBTLV3862QG

74CBTLV3862QG

Renesas Electronics America

IC BUS SWITCH 10 X 1:1 24QSOP

2118

CBT3253ADS,112

CBT3253ADS,112

NXP Semiconductors

IC MUX/DEMUX 2 X 4:1 16SSOP

28000

SN74HC253DT

SN74HC253DT

Texas Instruments

IC MULTIPLEXER 2 X 4:1 16SOIC

1000

SN74ALS857NT

SN74ALS857NT

Texas Instruments

IC MULTIPLEXER 6 X 2:1 24DIP

13959

74VHC157MTC

74VHC157MTC

Sanyo Semiconductor/ON Semiconductor

IC MULTIPLEXER 4 X 2:1 16TSSOP

698

74VHC153FT(BJ)

74VHC153FT(BJ)

Toshiba Electronic Devices and Storage Corporation

IC MULTIPLEXER 2 X 4:1 16TSSOPB

1478

CY74FCT157CTDR

CY74FCT157CTDR

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16SOIC

5000

SN74LS257BN

SN74LS257BN

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16DIP

1146

MC10174P

MC10174P

MUX 1-ELEMENT ECL

2803

MAX329EPE

MAX329EPE

Analog Devices, Inc.

LOW LEAKAGE ANALOG MUX

525

74CBTLV3244BQ,115

74CBTLV3244BQ,115

Nexperia

IC BUS SWITCH 4 X 1:1 20DHVQFN

40730

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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