Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
HEF4053BT-Q100118

HEF4053BT-Q100118

NXP Semiconductors

SPDT

0

CBT3245ABQ,115

CBT3245ABQ,115

Nexperia

IC BUS SWITCH 8 X 1:1 20DHVQFN

0

MC74F258AN

MC74F258AN

MULTIPLEXER, F/FAST SERIES, 4 FU

2250

74CBTLV3253PGG

74CBTLV3253PGG

Renesas Electronics America

IC MUX/DEMUX 2 X 4:1 16TSSOP

219

SN74CBT16292DL

SN74CBT16292DL

Texas Instruments

IC MUX/DEMUX 12 X 1:2 56SSOP

320

74AHCT257D-Q100J

74AHCT257D-Q100J

Nexperia

IC MULTIPLEXER 4 X 2:1 16SO

0

NB4N840MMNTWG

NB4N840MMNTWG

IC CROSSPOINT SW 2 X 2:2 32QFN

3681

CD4515BD3

CD4515BD3

4-BIT LATCH/4-TO-16 LINE DECODER

168

CD4066BK

CD4066BK

CMOS LOGIC QUAD BILATERAL SWITCH

1101

54LS253DMQB

54LS253DMQB

MULTIPLEXER, LS SERIES

4751

CCBTLV3861IPWRG4Q1

CCBTLV3861IPWRG4Q1

Texas Instruments

IC BUS SWITCH 10 X 1:1 24TSSOP

1162

SN74CBT3257DBR

SN74CBT3257DBR

Texas Instruments

IC MUX/DEMUX 4 X 2:1 16SSOP

1173

74FST3251DT

74FST3251DT

MUX AND DEMUX/DECODER

3648

SNJ54S257J

SNJ54S257J

Texas Instruments

54S257 QUADRUPLE 2-LINE TO 1-LIN

0

MAX4520EUT

MAX4520EUT

Analog Devices, Inc.

R-R SPST ANALOG SWITCH

175

54F153FMQB

54F153FMQB

MULTIPLEXER, F/FAST SERIES

3865

CY74FCT257CTSOCT

CY74FCT257CTSOCT

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16SOIC

91000

74CB3Q3125DBQRE4

74CB3Q3125DBQRE4

Texas Instruments

IC BUS SWITCH 1 X 1:1 16SSOP

0

SN74LV139ADE4

SN74LV139ADE4

Texas Instruments

IC DECODER/DEMUX 1X2:4 16SOIC

2500

39MPEGS422PBA17C

39MPEGS422PBA17C

ENHANCED DIGITAL VIDEO DECODER

0

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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