Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
74FCT157TQ

74FCT157TQ

74FCT157 - FAST QUAD 2-INPUT MUX

4797

MAX466CWI

MAX466CWI

Analog Devices, Inc.

TWO-CH QUAD RGB SWITCH AND BUFF

901

FSTU3384WM

FSTU3384WM

IC BUS SWITCH 5 X 1:1 24SOP

9750

CD74HC237E

CD74HC237E

Texas Instruments

IC DECODER/DEMUX 1X3:8 16DIP

2181

SN74ALS352D

SN74ALS352D

Texas Instruments

MULTIPLEXER, ALS SERIES

1750

SN74HC138N

SN74HC138N

Texas Instruments

IC DECODER/DEMUX 1X3:8 16DIP

6454

HEF4051BTT-Q100118

HEF4051BTT-Q100118

NXP Semiconductors

SINGLE-ENDED MUX, 8 CHANNEL

2500

MC74VHCT257ADR2

MC74VHCT257ADR2

IC MULTIPLEXER 4 X 2:1 16SOIC

5000

SN74LS348D

SN74LS348D

Texas Instruments

IC PRIORITY ENCOD 1 X 8:3 16SOIC

106

74LVC1G157GM,115

74LVC1G157GM,115

Nexperia

IC MULTIPLX 1 X 2:1 6XSON/SOT886

2660

CD4066BM96

CD4066BM96

Texas Instruments

IC BILATERAL SW 1 X 1:1 14SOIC

0

HEF4052BT/C118

HEF4052BT/C118

NXP Semiconductors

DIFFERENTIAL MUX

2500

SN54ALS253J

SN54ALS253J

Texas Instruments

MULTIPLEXER, ALS SERIES

0

SN74LS156DR

SN74LS156DR

Texas Instruments

IC DECODER/DEMUX 2X1:4 16SOIC

2063

74AC138SJX-ON

74AC138SJX-ON

DECODER/DRIVER, AC SERIES, INVER

10000

SN74LV138AD

SN74LV138AD

Texas Instruments

IC DECODER/DEMUX 1X3:8 16SOIC

28

74AUP1G157GXZ

74AUP1G157GXZ

NXP Semiconductors

IC MULTIPLEXER 1 X 2:1 6X2SON

86000

MC74AC251D

MC74AC251D

MULTIPLEXER, AC SERIES, 1 FUNC,

5211

QS74FCT139CTQ

QS74FCT139CTQ

IC DECODER 2 X 4:2

1165

74AUP1G19GW,125

74AUP1G19GW,125

Nexperia

IC DECODER/DEMUX 1X1:2 6TSSOP

2966

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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