Logic - Parity Generators and Checkers

Part Number	Description / PDF	Quantity
QS74FCT1280ATSO	PARITY GENERATOR/CHECKER, 9-BIT	166
QS74FCT2521BTSO	IC IDENTITY COMPARATOR 8-BIT	248
CD74ACT280E Texas Instruments	IC PARITY GEN/CHKER 9-BIT 14DIP	6552825
QS74FCT2521CTP	IC IDENTITY COMPARATOR 8-BIT	111
DM74AS286MX	IC PARITY GEN/CHKER 9-BIT 14SOIC	40000
74HCT280DB112 NXP Semiconductors	NOW NEXPERIA 74HCT280DB PARITY G	1092
54F402FMQB	CRC GENERATOR, F/FAST SERIES	87
DM93S62N	PARITY GENERATOR/CHECKER, 9-BIT	2040
74AC280SCX	IC PARITY GEN/CHKER 9-BIT 14SOIC	2499
N74F280BD,623 NXP Semiconductors	IC PARITY GEN/CHKER 9-BIT 14SO	7500
COM8136-6P Fluke Electronics	DUAL BAUD RATE GENERATOR	0
74HC280D,653 Nexperia	IC PARITY GEN/CHKER 9-BIT 14SO	2375
SN74F280BN Texas Instruments	SN74F280B 9-BIT ODD/EVEN PARITY	21092
MC10H160FNG	IC GEN/CHKER 12-BIT 20PLCC	5198
SN74AS286N Texas Instruments	SN74AS286 9-BIT PARITY GENERATOR	22725
SN74AS280DE4 Texas Instruments	IC PARITY GEN/CHKER 9-BIT 14SOIC	178
CD74HC280MT Texas Instruments	IC PARITY GEN/CHKER 9-BIT 14SOIC	3364750
74ACT11286N Texas Instruments	IC PARITY GEN/CHKER 9-BIT 14DIP	12300
CD54ACT280F/3A	9-BIT ODD/EVEN PARTITY GENERATOR	40
54F280DC	PARITY GENERATOR/CHECKER	275

Logic - Parity Generators and Checkers

1. Overview

Parity generators and checkers are digital logic ICs used to detect errors in data transmission or storage systems. These circuits generate a parity bit (even or odd) during data transmission and verify the parity at the receiver end to ensure data integrity. They play a critical role in applications requiring error detection, such as communication systems, memory modules, and industrial automation. By adding redundancy through parity bits, these ICs help identify single-bit errors, enhancing system reliability.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Even/Odd Parity Generator	Generates a parity bit to ensure even or odd number of 1s in data	Serial communication protocols (RS-232)
Parity Checker	Verifies received data against transmitted parity bit	RAM error detection systems
Multifunction Parity IC	Supports both generation and checking in a single chip	Networking hardware (Ethernet switches)
High-Speed Parity IC	Optimized for GHz-range data transmission	Fiber optic communication systems

3. Structure and Composition

These ICs typically consist of XOR/XNOR logic gates arranged in combinatorial circuits. Key components include:

Input buffers for data signal conditioning
Parity computation logic (tree-based XOR structures)
Control pins for parity mode selection (even/odd)
Output drivers for parity bit transmission
Standard packages: TSSOP, QFN, or BGA with 14-100 pins

4. Key Technical Specifications

Parameter	Typical Value	Importance
Operating Voltage	1.8V - 5.5V	Ensures compatibility with system logic levels
Propagation Delay	3 - 20 ns	Determines maximum data rate support
Power Consumption	10 - 100 mW	Impacts thermal design and efficiency
Parity Bit Width	4/8/16 bits	Defines data bus compatibility
Operating Temperature	-40 C to +125 C	Critical for industrial/environmental reliability

5. Application Fields

Telecommunications: 5G base stations, satellite modems
Computer Systems: ECC memory controllers, RAID storage arrays
Industrial Automation: PLC data integrity verification
Consumer Electronics: Smartcard readers, IoT wireless modules

Case Study: In DDR4 memory systems, parity checkers validate address/command lines at 3200MT/s data rates.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	SN74LVC1G18	Single-bit parity generator with 2ns delay
NXP Semiconductors	74FCT273T	Octal parity checker for SCSI interfaces
Intel	PAT16G44	16-bit parity engine for Xeon processors
AMD	Am7960	Integrated parity solution for network switches

7. Selection Guidelines

Data Bus Width: Match IC parity width to system data path (e.g., 8-bit for UART)
Speed Requirements: Propagation delay must satisfy Nyquist criteria for clock rate
Power Budget: Low-power variants (e.g., CMOS) for battery-operated devices
Environmental Factors: Automotive-grade parts (-40 C to +150 C) for vehicle systems
Cost vs. Integration: Multifunction ICs reduce PCB space but may increase BOM cost

8. Industry Trends

Future developments include:

Integration with advanced error correction (SEC-DED) in 3D-stacked memory
Support for emerging 112Gbps+ SerDes interfaces
AI-driven parity optimization in data centers
Photonics-compatible parity circuits for optical computing

Market demand grows at 6.2% CAGR (2023-2030), driven by autonomous vehicle safety systems and 6G infrastructure.