Logic - Gates and Inverters

Image Part Number Description / PDF Quantity Rfq
TC7SZ02F,LJ(CT

TC7SZ02F,LJ(CT

Toshiba Electronic Devices and Storage Corporation

IC GATE NOR 1CH 2-INP SMV

0

7UL1T08FU,LF

7UL1T08FU,LF

Toshiba Electronic Devices and Storage Corporation

IC GATE AND 1CH 2-INP USV

5041

TC74HC08APF

TC74HC08APF

Toshiba Electronic Devices and Storage Corporation

IC GATE AND 4CH 2-INP 14DIP

673

TC7SZU04F,LJ(CT

TC7SZU04F,LJ(CT

Toshiba Electronic Devices and Storage Corporation

IC INVERTER 1CH 1-INP SMV

0

TC74HC04AF(EL,F)

TC74HC04AF(EL,F)

Toshiba Electronic Devices and Storage Corporation

IC INVERTER 6CH 6-INP 14SOP

0

TC7SET08F,LJ(CT

TC7SET08F,LJ(CT

Toshiba Electronic Devices and Storage Corporation

IC GATE AND 1CH 2-INP SMV

207

74LCX02FT(AJ)

74LCX02FT(AJ)

Toshiba Electronic Devices and Storage Corporation

IC GATE NOR 4CH 2-INP 14TSSOPB

5000

TC74ACT08PF

TC74ACT08PF

Toshiba Electronic Devices and Storage Corporation

IC GATE AND 4CH 2-INP 14DIP

0

TC74HC02APF

TC74HC02APF

Toshiba Electronic Devices and Storage Corporation

IC GATE NOR 4CH 2-INP 14DIP

768

TC74ACT32FT(EL)

TC74ACT32FT(EL)

Toshiba Electronic Devices and Storage Corporation

IC GATE OR 4CH 2-INP 14TSSOP

0

TC7PZ14FU,LJ(CT

TC7PZ14FU,LJ(CT

Toshiba Electronic Devices and Storage Corporation

IC INVERTER SCHMITT 2CH 2-IN US6

7945

TC7SET02FU,LJ(CT

TC7SET02FU,LJ(CT

Toshiba Electronic Devices and Storage Corporation

IC GATE NOR 1CH 2-INP USV

0

TC7SZ02FE,LJ(CT

TC7SZ02FE,LJ(CT

Toshiba Electronic Devices and Storage Corporation

IC GATE NOR 1CH 2-INP ESV

3709

TC4081BF(EL,N,F)

TC4081BF(EL,N,F)

Toshiba Electronic Devices and Storage Corporation

IC GATE AND 4CH 2-INP 14SOP

109

TC4584BF(EL,N,F)

TC4584BF(EL,N,F)

Toshiba Electronic Devices and Storage Corporation

IC INVERT SCHMITT 6CH 6-IN 14SOP

0

7UL1G86FU,LF

7UL1G86FU,LF

Toshiba Electronic Devices and Storage Corporation

IC GATE XOR 1CH 2-INP USV

5950

TC7SZ08F,LJ(CT

TC7SZ08F,LJ(CT

Toshiba Electronic Devices and Storage Corporation

IC GATE AND 1CH 2-INP SMV

4168

TC74HC00AFELF

TC74HC00AFELF

Toshiba Electronic Devices and Storage Corporation

IC GATE NAND 4CH 2-INP 14SOP

0

TC74LCX32FTELM

TC74LCX32FTELM

Toshiba Electronic Devices and Storage Corporation

IC GATE OR 4CH 2-INP 14TSSOP

410

TC74VHC14FK(EL,K)

TC74VHC14FK(EL,K)

Toshiba Electronic Devices and Storage Corporation

IC INVERTER 6CH 6-INP 14VSSOP

0

Logic - Gates and Inverters

1. Overview

Logic gates and inverters are fundamental components of digital integrated circuits (ICs). They perform basic logical operations (AND, OR, NOT, etc.) and signal inversion, forming the building blocks of complex digital systems. These components enable Boolean algebra implementation in hardware, driving functions in computers, communication systems, industrial automation, and consumer electronics. Their reliability, speed, and miniaturization have been critical to advancements in modern electronics.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
AND GateOutputs HIGH only when all inputs are HIGHAddress decoding in memory circuits
OR GateOutputs HIGH if at least one input is HIGHSignal combining in control systems
NOT Gate (Inverter)Reverses input signal (HIGH LOW)Digital signal conditioning
NAND GateAND followed by inversion (universal gate)Universal logic implementation
NOR GateOR followed by inversion (universal gate)High-speed arithmetic circuits
XOR GateOutputs HIGH when inputs differError detection/correction circuits

3. Structure and Composition

Logic gates and inverters are fabricated using semiconductor technologies like CMOS (Complementary Metal-Oxide-Semiconductor), TTL (Transistor-Transistor Logic), or ECL (Emitter-Coupled Logic). A typical CMOS-based gate includes:

  • Substrate: Silicon wafer with p-well/n-well regions
  • Transistors: Paired NMOS and PMOS devices for signal switching
  • Interconnects: Aluminum/copper layers for input/output connections
  • Encapsulation: Plastic/ceramic packages (DIP, SOP, QFN) with 14 20 pins

Advanced nodes (e.g., 7nm FinFET) integrate 3D transistor structures for improved performance.

4. Key Technical Specifications

ParameterDescriptionImportance
Propagation DelayTime between input change and output responseDetermines maximum operating frequency
Supply Voltage (VCC)Operating voltage range (e.g., 1.8V 5.5V)Defines compatibility with system voltage
Power DissipationEnergy consumed during operationImpacts thermal management and battery life
Output Drive CapabilityMaximum current/voltage outputDictates fan-out and load capacity
Operating TemperatureTemperature range (-40 C to 125 C)Ensures reliability in harsh environments

5. Application Domains

  • Computing: CPUs, GPUs, ALUs, memory controllers
  • Communication: Routers, modems, 5G base stations
  • Industrial: PLCs, motor controllers, sensors
  • Consumer Electronics: Smartphones, TVs, gaming consoles
  • Automotive: ECUs, ADAS, infotainment systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductsKey Features
Texas InstrumentsSN74LVC1G08 (AND gate)Ultra-low power, 1.65V 5.5V supply
NXP Semiconductors74HCT03 (NAND gate)High-speed CMOS, TTL-compatible
STMicroelectronicsSTM74HC04 (Hex Inverter)Industrial temperature range
IntelFPGA-based logic arraysReconfigurable gate-level logic

7. Selection Guidelines

Key considerations include:

  • Speed vs. Power: High-speed (ECL/TTL) for performance-critical tasks; CMOS for low power
  • Voltage Compatibility: Match supply voltage with system requirements
  • Package Type: DIP for prototyping, QFN for space-constrained PCBs
  • Environmental Demands: Automotive-grade parts for high-temperature resilience
  • Cost: Balance performance needs with budget constraints

Example: Choosing SN74LVC1G32 (OR gate) for a 3.3V IoT device ensures low power consumption and compact integration.

8. Industry Trends

  • Advanced Node Scaling: Transition to 5nm/3nm processes for higher density
  • 3D Integration: Stacked die architectures for improved performance
  • Green Manufacturing: Reduced lead/tin content and energy-efficient fabrication
  • AI-Driven Design: Machine learning for optimized logic synthesis
  • Automotive Focus: Increased demand for AEC-Q100 qualified parts
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