Logic - Flip Flops

Part Number	Description / PDF	Quantity
74HC74D/C4118 NXP Semiconductors	D FLIP-FLOP, HC/UH SERIES	2000
74AHC374D,118 NXP Semiconductors	NOW NEXPERIA 74AHC374D - BUS DRI	39768
74LVC821AD,118 NXP Semiconductors	BUS DRIVER	0
74HC74BQ/S400115 NXP Semiconductors	D FLIP-FLOP, HC/UH SERIES PQCC14	1788
74HC374N NXP Semiconductors	BUS DRIVER, HC/UH SERIES, 8-BIT	0
74ABT374ADB,112 NXP Semiconductors	BUS DRIVER, ABT SERIES	4620
74HCT273N,652 NXP Semiconductors	D FLIP-FLOP	6688
N74F374N,602 NXP Semiconductors	BUS DRIVER	4121
74AHCT1G79GW-Q100125 NXP Semiconductors	D FLIP-FLOP, AHCT/VHCT SERIES	0
74ABT574AD,112 NXP Semiconductors	BUS DRIVER	2532
74HC107DB,112 NXP Semiconductors	J-K FLIP-FLOP, HC/UH SERIES, 2-F	0
74AHC1G79GW-Q100125 NXP Semiconductors	D FLIP-FLOP, AHC SERIES	614485
74LV273D,112 NXP Semiconductors	D FLIP-FLOP	5372
74AUP1G80GS,132 NXP Semiconductors	NOW NEXPERIA 74AUP1G80GS - D FLI	120000
74AUP2G80GD,125 NXP Semiconductors	D FLIP-FLOP, AUP/ULP/V SERIES, 2	176611
N74F112N,602 NXP Semiconductors	J-K FLIP-FLOP	2000
74LVC74AD/AU118 NXP Semiconductors	D FLIP-FLOP, LVC/LCX/Z SERIES	5000
74AUP1G374GM,115 NXP Semiconductors	NOW NEXPERIA 74AUP1G374GM - D FL	95000
74AHC273D,112 NXP Semiconductors	NOW NEXPERIA 74AHC273D - D FLIP-	23028
74LVC74AD/C118 NXP Semiconductors	D FLIP-FLOP, LVC/LCX/Z SERIES	92500

Logic - Flip Flops

1. Overview

Flip flops are fundamental building blocks in digital electronics, serving as bistable multivibrators capable of storing one bit of data. They form the basis of sequential logic circuits, enabling data storage, synchronization, and state control. Their ability to maintain stable states until triggered by clock signals makes them critical in memory units, counters, and register files. Modern computing, telecommunications, and automation systems rely heavily on flip flops for reliable data management and timing control.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
SR Flip Flop	Set-Reset operation with undefined state when both inputs activate	Basic memory elements, control circuits
D Flip Flop	Data storage with single data input synchronized by clock edge	Registers, shift registers, data buffers
JK Flip Flop	Universal type eliminating invalid states through feedback	Counters, frequency dividers, state machines
T Flip Flop	Toggle state with each clock pulse when input active	Binary counters, clock division circuits

3. Structure and Composition

Flip flops are typically constructed using transistor-transistor logic (TTL) or complementary metal-oxide-semiconductor (CMOS) technologies. A standard CMOS D flip flop contains 8-12 transistors arranged in master-slave configuration with transmission gates. Key components include:

Clock signal input for synchronization
Data input/output terminals
Feedback paths for state retention
Level-sensitive or edge-triggered control circuitry

4. Key Technical Specifications

Parameter	Typical Range	Importance
Clock Frequency	DC to 10GHz (varies by technology)	Determines maximum operating speed
Propagation Delay	1-10ns (CMOS), 3-20ns (TTL)	Impacts circuit timing margins
Power Consumption	1mW-100mW per flip flop	Critical for battery-powered devices
Setup/Hold Time	0.1-2ns	Essential for reliable data capture
Output Drive Strength	2mA-24mA	Affects fan-out capability

5. Application Domains

Telecommunications: Synchronization circuits in 5G base stations, optical transceivers
Computing: CPU register files, cache memory controllers
Industrial Control: Programmable logic controllers (PLCs), sensor interfaces
Consumer Electronics: Timing circuits in smartphones, wearable devices
Automotive: CAN bus controllers, ADAS synchronization modules

6. Leading Manufacturers and Products

Manufacturer	Representative Products	Key Features
Texas Instruments	SN74LVC1G80	Single D flip flop with 14ns delay, 2GHz clock rate
STMicroelectronics	STM74HC74ADG	Dual D flip flop with 8mA drive, 125MHz operation
NXP Semiconductors	74AUP1G175GF	Low-power quad D flip flop, 0.9V-3.6V operation
Intel	IOP333B00ES	High-speed differential flip flops for FPGA interfaces

7. Selection Guidelines

Key selection criteria include:

Speed requirements vs. power budget trade-offs
Compatibility with existing logic families (TTL/CMOS)
Package type (QFP, BGA, WLCSP) for PCB constraints
Environmental specifications (temperature range, radiation hardness)
Integration level (discrete vs. embedded in FPGAs/ASICs)

Example: For high-speed networking equipment, select flip flops with <1ns jitter and LVDS compatibility.

8. Industry Trends

Current development trends include:

Migration to FinFET and GAAFET transistor structures for sub-5nm nodes
Integration with on-die clocking networks in 3D-stacked ICs
Emergence of spin-transfer torque flip flops for non-volatile memory
Adoption of photonics-ready flip flops for optical computing interfaces
Development of ultra-low-voltage ( 0.5V) flip flops for IoT applications