Logic - Flip Flops

Part Number	Description / PDF	Quantity
SN74HC174NSR Texas Instruments	SN74HC174 HEX D-TYPE FLIP-FLOPS	5000
74AHC377D,112 Nexperia	D FLIP-FLOP, AHC SERIES, 1 FUNC,	1803
DM74ALS534WMX	BUS DRIVER	7319
74FCT823CTSOG	BUS INTERFACE REGISTER	1882
MC74HC374ADW	BUS DRIVER	0
74HC107DB,112-NXP NXP Semiconductors	J-K FLIP-FLOP, HC/UH SERIES, 2-F	0
74AHCT273PW-Q100J Nexperia	IC FF D-TYPE SNGL 8BIT 20TSSOP	0
CY74FCT825CTQCT Texas Instruments	CY74FCT825T 8-BIT BUS INTERFACE	9780
SN74ABT16823DGGR Texas Instruments	SN74ABT16823 18-BIT BUS INTERFAC	6000
CD54HCT173F3A	D FLIP-FLOP, HCT SERIES, 4-BIT	103
SN74HCT377DW Texas Instruments	IC FF D-TYPE SNGL 8BIT 20SOIC	1026
CD74HCT374EE4 Texas Instruments	CD74HCT374 HIGH SPEED CMOS LOGIC	0
100353QC	D FLIP-FLOP, 100K SERIES	1540
SN74LV574ANSR Texas Instruments	IC FF D-TYPE SNGL 8BIT 20SO	5073
SN74AHCT174DBR Texas Instruments	SN74AHCT174 HEX D-TYPE FLIP-FLOP	30000
74AHCT74PW,112 Nexperia	IC FF D-TYPE DUAL 1BIT 14TSSOP	0
74HC107PW,112 Nexperia	IC FF JK TYPE DUAL 1BIT 14TSSOP	0
CD74AC109M	DUAL J-K FLIP-FLOP	5940
SY10EP51VKG Roving Networks / Microchip Technology	IC FF D-TYPE SNGL 1BIT 8MSOP	55
DM74AS874WM	BUS DRIVER	889

Logic - Flip Flops

1. Overview

Flip flops are fundamental building blocks in digital electronics, serving as bistable multivibrators capable of storing one bit of data. They form the basis of sequential logic circuits, enabling data storage, synchronization, and state control. Their ability to maintain stable states until triggered by clock signals makes them critical in memory units, counters, and register files. Modern computing, telecommunications, and automation systems rely heavily on flip flops for reliable data management and timing control.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
SR Flip Flop	Set-Reset operation with undefined state when both inputs activate	Basic memory elements, control circuits
D Flip Flop	Data storage with single data input synchronized by clock edge	Registers, shift registers, data buffers
JK Flip Flop	Universal type eliminating invalid states through feedback	Counters, frequency dividers, state machines
T Flip Flop	Toggle state with each clock pulse when input active	Binary counters, clock division circuits

3. Structure and Composition

Flip flops are typically constructed using transistor-transistor logic (TTL) or complementary metal-oxide-semiconductor (CMOS) technologies. A standard CMOS D flip flop contains 8-12 transistors arranged in master-slave configuration with transmission gates. Key components include:

Clock signal input for synchronization
Data input/output terminals
Feedback paths for state retention
Level-sensitive or edge-triggered control circuitry

4. Key Technical Specifications

Parameter	Typical Range	Importance
Clock Frequency	DC to 10GHz (varies by technology)	Determines maximum operating speed
Propagation Delay	1-10ns (CMOS), 3-20ns (TTL)	Impacts circuit timing margins
Power Consumption	1mW-100mW per flip flop	Critical for battery-powered devices
Setup/Hold Time	0.1-2ns	Essential for reliable data capture
Output Drive Strength	2mA-24mA	Affects fan-out capability

5. Application Domains

Telecommunications: Synchronization circuits in 5G base stations, optical transceivers
Computing: CPU register files, cache memory controllers
Industrial Control: Programmable logic controllers (PLCs), sensor interfaces
Consumer Electronics: Timing circuits in smartphones, wearable devices
Automotive: CAN bus controllers, ADAS synchronization modules

6. Leading Manufacturers and Products

Manufacturer	Representative Products	Key Features
Texas Instruments	SN74LVC1G80	Single D flip flop with 14ns delay, 2GHz clock rate
STMicroelectronics	STM74HC74ADG	Dual D flip flop with 8mA drive, 125MHz operation
NXP Semiconductors	74AUP1G175GF	Low-power quad D flip flop, 0.9V-3.6V operation
Intel	IOP333B00ES	High-speed differential flip flops for FPGA interfaces

7. Selection Guidelines

Key selection criteria include:

Speed requirements vs. power budget trade-offs
Compatibility with existing logic families (TTL/CMOS)
Package type (QFP, BGA, WLCSP) for PCB constraints
Environmental specifications (temperature range, radiation hardness)
Integration level (discrete vs. embedded in FPGAs/ASICs)

Example: For high-speed networking equipment, select flip flops with <1ns jitter and LVDS compatibility.

8. Industry Trends

Current development trends include:

Migration to FinFET and GAAFET transistor structures for sub-5nm nodes
Integration with on-die clocking networks in 3D-stacked ICs
Emergence of spin-transfer torque flip flops for non-volatile memory
Adoption of photonics-ready flip flops for optical computing interfaces
Development of ultra-low-voltage ( 0.5V) flip flops for IoT applications