Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
CY7C464-65PC

CY7C464-65PC

Rochester Electronics

FIFO, 32KX9, 65NS, ASYNCHRONOUS

18

CY7C43664-7AC

CY7C43664-7AC

Rochester Electronics

BI-DIRECTIONAL FIFO, 4KX36

30

CY7C409A-35DMB

CY7C409A-35DMB

Rochester Electronics

64 X 8 CAADABLE FIFO 64 X 9 CAAD

35

CY7C4221-25JCT

CY7C4221-25JCT

Rochester Electronics

FIFO, 1KX9, 15NS, SYNCHRONOUS

750

CY7C421-40JCT

CY7C421-40JCT

Rochester Electronics

FIFO, 512X9, 40NS, ASYNCHRONOUS

750

CY7C421-40JC

CY7C421-40JC

Rochester Electronics

FIFO, 512X9, 40NS, ASYNCHRONOUS

2595

74F403SPC

74F403SPC

Rochester Electronics

FIFO, 16X4, SYNCHRONOUS, TTL, PD

1873

CY7C4281V-10JC

CY7C4281V-10JC

Rochester Electronics

FIFO, 64KX9, 8NS, SYNCHRONOUS

73

CY7C429-65JC

CY7C429-65JC

Rochester Electronics

FIFO, 2KX9, 65NS, ASYNCHRONOUS

455

CY7C419-15VC

CY7C419-15VC

Rochester Electronics

FIFO, 256X9, 15NS, ASYNCHRONOUS

650

CY7C4225-25AC

CY7C4225-25AC

Rochester Electronics

FIFO, 1KX18, 15NS, SYNCHRONOUS

462

CY7C4245-25JC

CY7C4245-25JC

Rochester Electronics

FIFO, 4KX18, 15NS, SYNCHRONOUS

231

CY7C470-40JI

CY7C470-40JI

Rochester Electronics

FIFO, 8KX9, 40NS, ASYNCHRONOUS

45

CY7C424-40PC

CY7C424-40PC

Rochester Electronics

FIFO, 1KX9, 40NS, ASYNCHRONOUS

754

CY7C43663-15AC

CY7C43663-15AC

Rochester Electronics

FIFO, 4KX36, 10NS, SYNCHRONOUS

184

CY7C421-10JC

CY7C421-10JC

Rochester Electronics

FIFO, 512X9, 10NS, ASYNCHRONOUS

1174

CY7C4231-25JC

CY7C4231-25JC

Rochester Electronics

FIFO, 2KX9, 15NS, SYNCHRONOUS

247

CY7C4261-10JI

CY7C4261-10JI

Rochester Electronics

FIFO, 16KX9, 8NS, SYNCHRONOUS

197

CY7C425-30JI

CY7C425-30JI

Rochester Electronics

FIFO, 1KX9, 30NS, ASYNCHRONOUS

309

CY7C425-25VC

CY7C425-25VC

Rochester Electronics

FIFO, 1KX9, 25NS, ASYNCHRONOUS

40

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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