Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72V06L15JG

72V06L15JG

Renesas Electronics America

IC FIFO 16384X9 15NS 32PLCC

265

72215LB15PFGI

72215LB15PFGI

Renesas Electronics America

IC FIFO 512X18 SYNC 15NS 64-TQFP

0

72T18125L5BBI

72T18125L5BBI

Renesas Electronics America

IC FIFO 524X18 2.5V 5NS 240BGA

35

7202LA12JG

7202LA12JG

Renesas Electronics America

IC FIFO ASYNCH 1KX9 12NS 32PLCC

0

72V06L25JGI

72V06L25JGI

Renesas Electronics America

IC ASYNCH 8192X18 25NS 32PLCC

0

72V255LA10TFG8

72V255LA10TFG8

Renesas Electronics America

IC FIFO SS 8192X18 10NS 64-STQFP

0

72V3622L10PFG8

72V3622L10PFG8

Renesas Electronics America

IC BIFIFO 256X36X2 10NS 120-TQFP

0

72V01L15JG

72V01L15JG

Renesas Electronics America

IC ASYNCH 512X9 15NS 32-PLCC

0

7281L12PAG

7281L12PAG

Renesas Electronics America

IC MEM FIFO 512X9 12NS 56-TSSOP

0

7204L30DB

7204L30DB

Renesas Electronics America

IC MEM FIFO 4K X 9 ASYNC 28CDIP

0

72V36100L6PFG

72V36100L6PFG

Renesas Electronics America

IC FIFO 65536X36 SYNC 128TQFP

0

72245LB10JG8

72245LB10JG8

Renesas Electronics America

IC FIFO 1024X18 SYNC 10NS 68PLCC

0

72V245L10PFG

72V245L10PFG

Renesas Electronics America

IC FIFO SYNC 4KX18 10NS 64QFP

0

72V293L6PFG

72V293L6PFG

Renesas Electronics America

IC FIFO SYNC II 3.3V 80-TQFP

0

7201LA12JG

7201LA12JG

Renesas Electronics America

IC MEM FIFO 512X9 12NS 32-PLCC

0

72V36110L7-5BBGI8

72V36110L7-5BBGI8

Renesas Electronics America

IC FIFO 131KX36 7-5NS 144BGA

0

72V251L15PFGI

72V251L15PFGI

Renesas Electronics America

IC FIFO SYNC 4096X18 15NS 32QFP

0

7204L15J

7204L15J

Renesas Electronics America

IC FIFO 4KX9 15NS 32PLCC

20

72V3631L15PFG8

72V3631L15PFG8

Renesas Electronics America

IC FIFO SYNC 512X36 15NS 120TQFP

0

72251L15PFGI8

72251L15PFGI8

Renesas Electronics America

IC FIFO SYNC 512X9 15NS 32QFP

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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