Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72V205L15TF

72V205L15TF

Renesas Electronics America

IC FIFO SYNC 16KX9 15NS 64QFP

23

72V3640L7-5PFGI

72V3640L7-5PFGI

Renesas Electronics America

IC FIFO SYNC II 36BIT 128-TQFP

0

72V02L15JG

72V02L15JG

Renesas Electronics America

IC FIFO ASYNCH 1KX9 15NS 32PLCC

322

7201LA15TPGI

7201LA15TPGI

Renesas Electronics America

IC FIFO ASYNC 512X9 15NS 28DIP

0

72V3660L6PFG8

72V3660L6PFG8

Renesas Electronics America

IC FIFO SS 4096X36 6NS 128-TQFP

0

7201LA30DB

7201LA30DB

Renesas Electronics America

IC MEM FIFO 512X9 ASYNC 28CDIP

0

72V05L25JGI

72V05L25JGI

Renesas Electronics America

IC FIFO ASYNCH 4096X18 32PLCC

0

72V2111L10PFG

72V2111L10PFG

Renesas Electronics America

IC FIFO SS 512X9 10NS 64QFP

0

7202LA15SOGI8

7202LA15SOGI8

Renesas Electronics America

IC FIFO ASYNCH 1KX9 15NS 28SOIC

0

72V2101L10PFG8

72V2101L10PFG8

Renesas Electronics America

IC FIFO 262144X9 10NS 64TQFP

0

7202LA30DB

7202LA30DB

Renesas Electronics America

IC MEM FIFO 1024X9 ASYNC 28CDIP

0

72255LA10PFG8

72255LA10PFG8

Renesas Electronics America

IC FIFO 8KX18 LP 10NS 64QFP

0

72841L10PFG

72841L10PFG

Renesas Electronics America

IC FIFO SYNC 4KX9 10NS 64QFP

0

72V281L10PFG

72V281L10PFG

Renesas Electronics America

IC FIFO 32768X18 10NS 64QFP

0

7206L20DB

7206L20DB

Renesas Electronics America

IC MEM FIFO 16K X 9 ASYNC 28CDIP

0

723643L12PFG

723643L12PFG

Renesas Electronics America

IC MEM FIFO 1024X36 128-TQFP

0

72V36110L6BB8

72V36110L6BB8

Renesas Electronics America

IC FIFO SYNC 131KX36 6NS 144BGA

0

7208L25JGI

7208L25JGI

Renesas Electronics America

IC FIFO 64KX9 25NS 32PLCC

0

72V2103L6PFG8

72V2103L6PFG8

Renesas Electronics America

IC FIFO SUPERSYNCII 6NS 80-TQFP

0

72V275L10PFG8

72V275L10PFG8

Renesas Electronics America

IC FIFO SS 32768X18 10NS 64-TQFP

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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