Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
723623L12PFG8

723623L12PFG8

Renesas Electronics America

IC FIFO SYNC 1KX9 12NS 128QFP

0

72V01L25JGI8

72V01L25JGI8

Renesas Electronics America

IC FIFO 512X9 25NS 32-PLCC

0

SN74ACT7203L15NP

SN74ACT7203L15NP

Texas Instruments

FIFO, 2KX9, 15NS, ASYNCHRONOUS

2283

SN74ALVC7803-40DL

SN74ALVC7803-40DL

Texas Instruments

FIFO, 512X18, 20NS, SYNCHRONOUS

1167

72211L15PFGI

72211L15PFGI

Renesas Electronics America

IC FIFO 512X9 SYNC 15NS 32-TQFP

0

72215LB15PFGI8

72215LB15PFGI8

Renesas Electronics America

IC FIFO 512X18 SYNC 15NS 64-TQFP

0

CYF0072V18L-133BGXI

CYF0072V18L-133BGXI

Flip Electronics

FIFO FIFOS SYNCHRONOUS MEMORY

0

SN74ACT3632-15PQG4

SN74ACT3632-15PQG4

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36, 11N

900

72V02L25JGI8

72V02L25JGI8

Renesas Electronics America

IC FIFO ASYNCH 1KX9 25NS 32PLCC

0

SN74V245-7PAG

SN74V245-7PAG

Texas Instruments

IC SYNC FIFO MEM 4096X18 64-TQFP

444

72235LB10TFG8

72235LB10TFG8

Renesas Electronics America

IC FIFO 2048X18 SYNC 10NS 64TQFP

0

7200L35SO8

7200L35SO8

7200 - 256 X 9 ASYNCHRONOUS FIFO

114

SN74ACT7882-15PN

SN74ACT7882-15PN

Texas Instruments

FIFO, 2KX18, 12NS, SYNCHRONOUS

913

SN74ACT7202LA50DV

SN74ACT7202LA50DV

Texas Instruments

FIFO MEM ASYNC 16K X 9

436

72V36100L6PFG8

72V36100L6PFG8

Renesas Electronics America

IC FIFO 64X36 6NS 128QFP

0

7205L12PDG

7205L12PDG

Renesas Electronics America

IC FIFO 8192X9 12NS 28DIP

0

SN74ACT7804-20DL

SN74ACT7804-20DL

Texas Instruments

FIFO, 512X18, 20NS, SYNCHRONOUS,

19238

SN74V215-7PAG

SN74V215-7PAG

Texas Instruments

IC SYNC FIFO MEM 512X18 64-TQFP

196

72271LA10PFG8

72271LA10PFG8

Renesas Electronics America

IC FIFO 16384X18 LP 10NS 64QFP

0

CY7C429-15PC

CY7C429-15PC

FIFO, 2KX9, 15NS, ASYNCHRONOUS

11

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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