Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
CY7C429-15AC

CY7C429-15AC

FIFO, 2KX9, 15NS, ASYNCHRONOUS

547

SN74ACT7206L25RJ

SN74ACT7206L25RJ

Texas Instruments

FIFO, 16KX9, 25NS, ASYNCHRONOUS

2574

QS7204-50P

QS7204-50P

QUALITY SEMI FIFO 4KX9 ASYNC

469

CY7C4231-15JC

CY7C4231-15JC

Rochester Electronics

FIFO, 2KX9, 10NS, SYNCHRONOUS

1545

SN74ABT3614-20PCB

SN74ABT3614-20PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 64X36, 12NS

1894

723624L15PFG

723624L15PFG

Renesas Electronics America

IC FIFO SYNC 256X36X2 128TQFP

0

CY7C4221V-15AC

CY7C4221V-15AC

Rochester Electronics

FIFO, 1KX9, 11NS, SYNCHRONOUS

863

CY7C4215V-25ASC

CY7C4215V-25ASC

FIFO, 512X18, 15NS, SYNCHRONOUS

34

SN74V263-10PZA

SN74V263-10PZA

Texas Instruments

FIFO, 8KX18, 6.5NS, SYNCHRONOUS

518

CY7C425-15JC

CY7C425-15JC

Rochester Electronics

FIFO, 1KX9, 15NS, ASYNCHRONOUS

6802

72V241L10PFG8

72V241L10PFG8

Renesas Electronics America

IC FIFO SYNC 4KX9 10NS 32QFP

0

72V253L6PFG

72V253L6PFG

Renesas Electronics America

IC FIFO 4096X18 6NS 80QFP

0

CY7C4245-15JXC

CY7C4245-15JXC

IR (Infineon Technologies)

FIFO, 4KX18, 10NS, SYNCHRONOUS

3788

723624L15PFG8

723624L15PFG8

Renesas Electronics America

IC FIFO SYNC 256X36X2 128TQFP

0

72V221L15PFGI

72V221L15PFGI

Renesas Electronics America

IC FIFO SYNC 1KX9 15NS 32QFP

0

7203L25J

7203L25J

Renesas Electronics America

IC MEM FIFO 2048X9 25NS 32-PLCC

0

SN74ALVC7805-40DLR

SN74ALVC7805-40DLR

Texas Instruments

256 X 18 CLOCKED FIFO

2000

72V241L10PFG

72V241L10PFG

Renesas Electronics America

IC FIFO SYNC 4KX9 10NS 32QFP

0

72V845L15PFGI

72V845L15PFGI

Renesas Electronics America

IC FIFO SYNC 4096X18 128QFP

0

SN74ALVC3631-20PCB

SN74ALVC3631-20PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

249

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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