Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
CY7C433-20JC

CY7C433-20JC

FIFO, 4KX9, 20NS, ASYNCHRONOUS

2461

72801L10PFG

72801L10PFG

Renesas Electronics America

IC FIFO SYNC DUAL 256X9 64-TQFP

0

AM7203A-15RC

AM7203A-15RC

FIFO, 2KX9, 15NS, ASYNCHRONOUS

45

CY7C419-40JC

CY7C419-40JC

FIFO, 256X9, 40NS, ASYNCHRONOUS

289

CY7C4211V-15AXI

CY7C4211V-15AXI

IR (Infineon Technologies)

FIFO, 512X9, 11NS, SYNCHRONOUS

1698

7282L15PAGI8

7282L15PAGI8

Renesas Electronics America

IC NWN FIFO 1KX9 56TSSOP

0

72V36110L7-5BBI

72V36110L7-5BBI

Renesas Electronics America

IC FIFO 131KX36 7-5NS 144BGA

0

67C4033-10N

67C4033-10N

FIFO, 64X5, ASYNCHRONOUS

2150

CY7C443-30JC

CY7C443-30JC

Rochester Electronics

FIFO, 2KX9, 20NS, SYNCHRONOUS

280

SN74ACT2235-40PAG

SN74ACT2235-40PAG

Texas Instruments

BI-DIRECTIONAL FIFO, 1KX9

0

SN74ACT7881-15FN

SN74ACT7881-15FN

Texas Instruments

FIFO, 1KX18, 12NS, SYNCHRONOUS

2784

72V221L15PFG

72V221L15PFG

Renesas Electronics America

IC FIFO SYNC 1KX9 15NS 32QFP

0

72V225L10PFG

72V225L10PFG

Renesas Electronics America

IC FIFO SYNC 1024X18 10NS 64TQFP

0

72V36100L7-5PFGI8

72V36100L7-5PFGI8

Renesas Electronics America

IC FIFO 64X36 7-5NS 128QFP

0

67C4013-10NL

67C4013-10NL

FIFO, 64X4, ASYNCHRONOUS

2472

CY7C4205V-15ASXC

CY7C4205V-15ASXC

IR (Infineon Technologies)

FIFO, 256X18, 11NS, SYNCHRONOUS

23

7207L15JG

7207L15JG

Renesas Electronics America

IC FIFO 16384X18 15NS 32PLCC

0

72V251L10JG8

72V251L10JG8

Renesas Electronics America

IC FIFO SYNC 4096X18 10NS 32PLCC

0

CY7C429-30PI

CY7C429-30PI

FIFO, 2KX9, 30NS, ASYNCHRONOUS

0

CY7C43682-15AC

CY7C43682-15AC

Rochester Electronics

BI-DIRECTIONAL FIFO, 16KX36

414

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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