Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LV245APWJ Nexperia	IC TXRX NON-INVERT 5.5V 20TSSOP	1974
74AVCH8T245PW:118 Nexperia	IC TRANSLATION TXRX 3.6V 24TSSOP	2138
74LVC1G17GN,132 Nexperia	IC BUFFER NON-INVERT 5.5V 6XSON	2334
74LVC1G06GV,125 Nexperia	IC BUFFER INVERT 5.5V SC74A	7423
74LV1T126GWH Nexperia	IC BUF NON-INVERT 5.5V 5TSSOP	4759
74VHC126D-Q100J Nexperia	IC BUFFER NON-INVERT 5.5V 14SO	0
74HC365D-Q100,118 Nexperia	IC BUFFER NON-INVERT 6V 16SO	2400
74AVCH4T245D-Q100J Nexperia	IC TRANSLATION TXRX 3.6V 16SO	2243
74AUP3G16DCH Nexperia	IC BUF NON-INVERT 3.6V 8VSSOP	0
74HC541D,653 Nexperia	IC BUFFER NON-INVERT 6V 20SO	5067
74LVC244AD-Q100J Nexperia	IC BUFFER NON-INVERT 3.6V 20SO	0
74AUP2G3407GF,125 Nexperia	IC BUFFER NON-INVERT 3.6V 6XSON	5000
74AVCH4T245PW,118 Nexperia	IC TRANSLATION TXRX 3.6V 16TSSOP	23451
74LVT245BPW,118 Nexperia	IC TXRX NON-INVERT 3.6V 20TSSOP	3634
74LVC3G17GT,115 Nexperia	IC BUFFER NON-INVERT 5.5V 8XSON	3990
74LVT16245BDL,118 Nexperia	IC TXRX NON-INVERT 3.6V 48SSOP	787
74AUP2G3407GS,125 Nexperia	IC BUFFER NON-INVERT 3.6V 6XSON	5000
74AUP2G3407GSH Nexperia	IC BUFFER NON-INVERT 3.6V 6XSON	0
74HC2G17GW,125 Nexperia	IC BUFFER NON-INVERT 6V 6TSSOP	25999
74LV541ATPWJ Nexperia	IC BUF NON-INVERT 5.5V 20TSSOP	2499

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications