Logic - Buffers, Drivers, Receivers, Transceivers

Image	Part Number	Description / PDF	Quantity	Rfq
	74ACT245SJ Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 20SOP	0
	74ACTQ18825SSC Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 56SSOP	0
	74LVQ245SJX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 3.6V 20SOP	0
	74LVQ244QSCX Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 20QSOP	0
	MC74VHCT541ADWR2 Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 20SOIC	0
	74LCXP16245MEAX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 3.6V 48SSOP	0
	MC74VHC1G50DFT2 Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V SC88A	0
	MC74HC540AN Sanyo Semiconductor/ON Semiconductor	IC BUFFER INVERT 6V 20DIP	0
	74ACTQ543SCX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 24SOP	0
	74ACTQ646SC Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 24SOP	0
	74ACTQ244QSC Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 20QSOP	0
	SCAN18541TSSC Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 56SSOP	0
	MC74LVX50MG Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V SOEIAJ-14	0
	DM74ALS648NT Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 24DIP	0
	MM74HC541N Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 6V 20DIP	0
	74LVT2240WM Sanyo Semiconductor/ON Semiconductor	IC BUFFER INVERT 3.6V 20SOIC	0
	MC74ACT540DW Sanyo Semiconductor/ON Semiconductor	IC BUFFER INVERT 5.5V 20SOIC	0
	MC74AC125N Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 6V 14DIP	0
	MC74LVX244M Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V SOEIAJ-20	0
	74AC125MTCX Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 6V 14TSSOP	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications