Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74AUC1G125DCKRE4 Texas Instruments	IC BUFFER NON-INVERT 2.7V SC70-5	0
SN74AC240NSR Texas Instruments	IC BUFFER INVERT 6V 20SO	46000
74FCT162652CTPACT Texas Instruments	IC TXRX NON-INVERT 5.5V 56TSSOP	2199
SN64BCT244N Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	2800
74ACT11240DW Texas Instruments	IC BUFFER INVERT 5.5V 24SOIC	8446
SN74LV244ADB Texas Instruments	IC BUFF/DVR TRI-ST DUAL 20SSOP	22540
SN74ABT841NT Texas Instruments	BUS DRIVER, ABT SERIES, 10-BIT	1392
CY74FCT16244ETPVCT Texas Instruments	BUS DRIVER, FCT SERIES	6000
SN74LVCH245ADWR Texas Instruments	IC TXRX NON-INVERT 3.6V 20SOIC	782
SN74ALS646ADWR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	0
74LVCH322244AZKER Texas Instruments	IC BUFFER NON-INVERT 3.6V 96PBGA	12625
SN74LVCZ16245ADGGR Texas Instruments	IC TXRX NON-INVERT 3.6V 48TSSOP	17101
CD74HCT541M96E4 Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	0
SN74ABT543ADBRG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 24SSOP	0
CY74FCT162374ETPAC Texas Instruments	BUS DRIVER, FCT SERIES	6400
SN74BCT126AD Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOIC	15284
CD74HCT243EE4 Texas Instruments	IC TXRX NON-INVERT 5.5V 14DIP	760
SN74HCT541PW Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	376
SN74S240DW Texas Instruments	IC BUFFER INVERT 5.25V 20SOIC	13299
SN74LVC244ADWR Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	7345

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications