Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
HSP48410JC-33 Intersil (Renesas Electronics America)	HISTOGRAM PROCESSOR	1769
HA2-5002-5 Intersil (Renesas Electronics America)	IC BUFFER AMP BIPOLAR TO99-8	1882
HSP48410JC-40 Intersil (Renesas Electronics America)	HISTOGRAM PROCESSOR	273
HFA1114IP Intersil (Renesas Electronics America)	VIDEO CABLE DRIVING BUFFER	4786
HFA1114IB Intersil (Renesas Electronics America)	VIDEO CABLE DRIVING BUFFER	1233
HIP9020ABR3327S Intersil (Renesas Electronics America)	PROGRAMMABLE QUAD BUFFER WITH PR	1000
HIP9020ABR3327 Intersil (Renesas Electronics America)	PROGRAMMABLE QUAD BUFFER WITH PR	1000
CA3292AQ96 Intersil (Renesas Electronics America)	BUFFER/INVERTER PERIPHL DRIVER	36446
CP82C86HS2064 Intersil (Renesas Electronics America)	BUS TRANSCEIVER SERIES, 1 FUNC,	504
HIP0050IB96S2300 Intersil (Renesas Electronics America)	0.3A/50V OCTAL LOW SIDE POWER DR	1000
HCTS541DMSR Intersil (Renesas Electronics America)	IC BUF NON-INVERT 5.5V 20SBDIP	0
ACTS240KMSR Intersil (Renesas Electronics America)	IC BUF DRIVER 5.5V 20CFLATPACK	0
HCTS541KMSR Intersil (Renesas Electronics America)	IC BUFFER NON-INVERT 5.5V 8SOIC	0
ACTS240DMSR Intersil (Renesas Electronics America)	IC BUFFER INVERT 5.5V 20SBDIP	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications