Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
BTS149E3045ANTMA1 IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	0
BSP75-E6433 IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	493
PEB55508EV1.2 IR (Infineon Technologies)	GEMINAX MULTIPORT INTEGRATED ADS	1800
PEB22622FV1.3 IR (Infineon Technologies)	SOCRATES SDSL ADAPTIVE TRANSCEIC	29
BTS430K2E3122A IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	1000
BTS149NK IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	0
ICE1HS01GXUMA1 IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	15000
PEF22623EV2.1-G IR (Infineon Technologies)	ONE CHIP RATE ADAPTIVE TRANSCEIC	3585
BTS737S3NUMA1 IR (Infineon Technologies)	BUFFER/INVERTER BASED PERIPHERAL	69891
BTS441RSAKSA1 IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	0
PEF22818FV1.1 IR (Infineon Technologies)	VDSL-5 SINGLE PORT DIGITAL TRANS	28508
BTS7008-2EPA IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	0
BTC50010-1TAA IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	3434
PEB22716TV1.5 IR (Infineon Technologies)	GEMINAX MULTIPORT INTEGRATED AD	3554
BTS824RNUMA1 IR (Infineon Technologies)	BUFFER/INVERTER BASED PERIPHERAL	28162
PEF22824EV1.2 IR (Infineon Technologies)	OCTAL-10BASES DIGITAL TRANSCEICE	7040
BTS707NTMA1 IR (Infineon Technologies)	SMART TWO CHANNEL HIGHSIDE POWER	33295
BTC30010-1TAA IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	9025
BGT80E6327XTMA1 IR (Infineon Technologies)	BACKHAUL TRANSCEICER	5181

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications