Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVCH244ABX NXP Semiconductors	FUNC, 4 BIT, TRUE OUTPUT, CMOS,	0
74LVT244AD NXP Semiconductors	BUS DRIVER, LVT SERIES, 2-FUNC,	0
74AUP1G240GF/L132 NXP Semiconductors	IC BUFFER INVERT 3.6V 6XSON	0
74LVC1T45GW/C4125 NXP Semiconductors	BUS TRANSCVR, LVC/LCX/Z SERIES	43350
74HC2G17GW/C4125 NXP Semiconductors	IC BUFFER NON-INVERT 6V 6TSSOP	2071
74LVCH244APW/AUJ118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	0
PCAL6416AER118 NXP Semiconductors	LOW VOLTAGE TRANSLATING, 8 BIT I	12358
NTB0102DP-Q100125 NXP Semiconductors	DUAL SUPPLY TRANSLATING TRANSCEI	845
74LVT574PW/AU118 NXP Semiconductors	BUS DRIVER	2500
74AVC32T245EC518 NXP Semiconductors	BUS TRANSCEIVER, AVC SERIES	0
74ALVC164245DGG118 NXP Semiconductors	BUS TRANSCVR	0
74LVT16374ADGG653 NXP Semiconductors	BUS DRIVER, LVT SERIES, 4-BIT	6000
74LVC2G07GX147 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	0
74AVC16T245DGV-Q100118 NXP Semiconductors	BUS TRANSCEIVER, AVC SERIES	2060
74LVC1G07GW/AU125 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	1448666
PCAL6416AEX115 NXP Semiconductors	LOW VOLTAGE TRANSLATING, 8 BIT I	10870
74HC7540D/C4118 NXP Semiconductors	IC BUFFER INVERT 6V 20SO	363
74AUP2G07GX147 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 6X2SON	80000
CBT3306PW/S400118 NXP Semiconductors	BUS DRIVER, CBT SERIES	124665
MKE14Z128VLL7,557 NXP Semiconductors	KINETIS KE14Z: 72MHZ CORTEX M0+	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications