Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVC125APW/AU118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	44815
74HC640N,652 NXP Semiconductors	IC TRANSCEIVER INVERT 6V 20DIP	7558
74LVC3G17DP-Q100125 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	300000
74LVC374ABQ-Q100115 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	3000
74LVTH32245EC,518 NXP Semiconductors	IC TXRX NON-INVERT 3.6V 96LFBGA	10500
74LVC2G07GF/S500132 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	11300000
74AVCH1T45GW-Q100125 NXP Semiconductors	BUS TRANSCEIVER, AVC SERIES	150944
74HC4049DB,112-NXP NXP Semiconductors	IC BUFFER INVERT 6V 16SSOP	0
74ALVC164245DL/S410118 NXP Semiconductors	BUS TRANSCVR	73000
XC7WH126DP,125 NXP Semiconductors	NOW NEXPERIA XC7WH126DP - BUS DR	8834
74LVC543AD,112 NXP Semiconductors	IC TXRX NON-INVERT 3.6V 24SO	5950
74HC241N,652 NXP Semiconductors	IC BUFFER NON-INVERT 6V 20DIP	4426
74LVTH125BQ,115 NXP Semiconductors	IC BUF NON-INVERT 3.6V 14DHVQFN	2800
74LV541N,112 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 20DIP	720
74LVC125AD-Q100118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	4710
74LVC573APW/S400118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	5000
74HC9115N,112 NXP Semiconductors	IC BUFFER NON-INVERT 6V 20DIP	1205
74AHCT1G125GW/C4125 NXP Semiconductors	BUS DRIVER, AHCT/VHCT/VT SERIES	126000
74LVC2G17GW/S400125 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	27000
USB2SERA11CFK557 NXP Semiconductors	USB BUS CONTROLLER, CMOS	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications