Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74HC2G17GW/C125 NXP Semiconductors	IC BUFFER NON-INVERT 6V 6TSSOP	0
N74F541D,623 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 20SO	946
74LVCH16245ABQ,518 NXP Semiconductors	IC TXRX NON-INVERT 3.6V 60HUQFN	10000
74AUP2G125GN,115 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 8XSON	85398
74ALVT162823DGG112 NXP Semiconductors	BUS DRIVER, ALVT SERIES, 9-BIT	675
74ALVT162827DGG112 NXP Semiconductors	BUS DRIVER, ALVT SERIES, 10-BIT	875
74AHC1G07GW-Q100125 NXP Semiconductors	BUFFER, AHC/VHC/H/U/V SERIES	180000
74LVC2244ADB,112-NXP NXP Semiconductors	FUNC, 4 BIT, TRUE OUTPUT, CMOS,	0
74HC240DB,118-NXP NXP Semiconductors	IC BUFFER INVERT 6V 20SSOP	0
GTL2034PW,118 NXP Semiconductors	IC BUF NON-INVERT 3.6V 14TSSOP	1307
N74F827D,623 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 24SO	3000
74LVCH245APW/AU118 NXP Semiconductors	BUS TRANSCVR, LVC/LCX/Z SERIES	3450
74AVC8T245PW-Q100118 NXP Semiconductors	IC TRANSLATION TXRX 3.6V 24TSSOP	900
74ALVCH16244DL,112 NXP Semiconductors	BUS DRIVER, ALVC/VCX/A SERIES, 4	1581
74AHCT126PW/C1118 NXP Semiconductors	BUS DRIVER, AHCT/VHCT/VT SERIES	2500
74AUP2G3407GW125 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 6TSSOP	0
XC7SET125GM,132 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 6XSON	9800
74LVCH322245AEC NXP Semiconductors	IC TXRX NON-INVERT 3.6V 96LFBGA	83
74LVC543APW,112 NXP Semiconductors	IC TXRX NON-INVERT 3.6V 24TSSOP	2142
74HCT365D/C4118 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 16SO	2500

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications