Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVC244APW653 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	7500
74AHCT2G126GD,125 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 8XSON	68069
74AUP2G07GF/S500132 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 6XSON	1180000
74LVC3G07GD,125 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 8XSON	0
74HC126PW-Q100118 NXP Semiconductors	IC BUFFER NON-INVERT 6V 14TSSOP	0
74CBTLV16211DGG118 NXP Semiconductors	74CBTLV16211DGG - BUS DRIVER	0
74AHC573BQ-Q100115 NXP Semiconductors	BUS DRIVER, AHC/VHC/H/U/V SERIES	54000
74LVC16373ADGG/AU118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	28000
74HC125D/S400118 NXP Semiconductors	IC BUFFER NON-INVERT 6V 14SO	10000
74ALVCH162245DGG,112 NXP Semiconductors	74ALVCH162245DGG - BUS TRANSCEI	671
74ABT827D,602 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 24SO	2850
74LVT2245D,112 NXP Semiconductors	IC TXRX NON-INVERT 3.6V 20SO	982
74LVC3G07DP-Q100125 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	0
74ALVT16827DGG,112 NXP Semiconductors	IC BUF NON-INVERT 3.6V 56TSSOP	1575
74HC3G34GD,125 NXP Semiconductors	IC BUFFER NON-INVERT 6V 8XSON	56414
74LVT240PW,118 NXP Semiconductors	IC BUFFER INVERT 3.6V 20TSSOP	9530
74AVC8T245PW112 NXP Semiconductors	IC TRANSLATION TXRX 3.6V 24TSSOP	9097
74AHCT2G126DP-Q100125 NXP Semiconductors	BUS DRIVER	0
74LVC16373ADGG653 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	2000
74ALVCH162827DGG112 NXP Semiconductors	BUS DRIVER, ALVC/VCX/A SERIES	3500

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications