Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVCH16245AEV/G518 NXP Semiconductors	BUS TRANSCVR, LVC/LCX/Z SERIES	45500
74AHCT244PW/S400118 NXP Semiconductors	BUS DRIVER, AHCT/VHCT/VT SERIES	10193
74LVCH162244ADL112 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	0
74AHCT244PW-Q100118 NXP Semiconductors	BUS DRIVER, AHCT/VHCT/VT SERIES	11840
74LVCH16373ADL112 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	581
74LVT244APW-Q100118 NXP Semiconductors	BUS DRIVER, LVT SERIES, 4-BIT	5589
74LVTN16245BDGG118 NXP Semiconductors	BUS TRANSCVR, LVT SERIES, 8-BIT	0
74ALVCH162827DGG518 NXP Semiconductors	BUS DRIVER, ALVC/VCX/A SERIES	2000
74AHCT1G126GW/S400125 NXP Semiconductors	BUS DRIVER, AHCT/VHCT/VT SERIES	72000
74AHC541PW-Q100118 NXP Semiconductors	BUS DRIVER, AHC/VHC/H/U/V SERIES	20000
74HCT368N,652 NXP Semiconductors	IC BUFFER INVERT 5.5V 16DIP	975
74AXP1G125GS125 NXP Semiconductors	BUS DRIVER, AXP SERIES	98515
74ALVT16241DGG,512 NXP Semiconductors	IC BUF NON-INVERT 3.6V 48TSSOP	975
NXH2180UK,518 NXP Semiconductors	MI-RADIO TRANSCEIVER WITH FLASH	254949
74HC244D/S400118 NXP Semiconductors	IC BUFFER NON-INVERT 6V 20SO	2836
74LVCH16245ADGG-Q100118 NXP Semiconductors	BUS TRANSCVR, LVC/LCX/Z SERIES	5600
74HC245PW-Q100118 NXP Semiconductors	IC TXRX NON-INVERT 6V 20TSSOP	31681
PTN3360BBS518/BKN NXP Semiconductors	HDMI/DVI LEVEL SHIFTER	0
74HC125PW-Q100118 NXP Semiconductors	IC BUFFER NON-INVERT 6V 14TSSOP	19274
74LVC125AD/AU118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	6400

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications