Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVC3G07DC-Q100125 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	177000
74ALVCH16843DGG112 NXP Semiconductors	BUS DRIVER, ALVC/VCX/A SERIES	810
74LVC07APW/AU118 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	28360
74LVC2G126GT/S505115 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	1680
74AUP1G07GW/AU125 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 5TSSOP	0
74LVC245APW-Q100118 NXP Semiconductors	BUS TRANSCVR, LVC/LCX/Z SERIES	37479
74LVC16240ADGG-Q100118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	5700
74AXP2T3407GN115 NXP Semiconductors	BUFFER, AXP SERIES	0
74HC2G34GW-Q100125 NXP Semiconductors	IC BUFFER NON-INVERT 6V 6TSSOP	2600
74LVC1G125GV/S505125 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	5157
74ABT827D,623 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 24SO	2970
74LVC2G07GXZ NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 6X2SON	70000
74ABT540D,623 NXP Semiconductors	IC BUFFER INVERT 5.5V 20SO	42000
74ALVCH162245DGG,118 NXP Semiconductors	NOW NEXPERIA 74ALVCH162245DGG -	0
74LVC16245AEV,518 NXP Semiconductors	BUS TRANSCEIVER, LVC/LCX/Z SERIE	7000
74ABT2245DB,118 NXP Semiconductors	IC TXRX NON-INVERT 5.5V 20SSOP	5988
74ALVCH16841DGG112 NXP Semiconductors	BUS DRIVER, ALVC/VCX/A SERIES	4511
74LVT646PW,118 NXP Semiconductors	IC TXRX NON-INVERT 3.6V 24TSSOP	2500
MC33901WEF574 NXP Semiconductors	HIGH SPEED CAN TRANSCEIVER	0
74LVC2G125DC-Q100125 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	14801

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications