Logic - Buffers, Drivers, Receivers, Transceivers

Image Part Number Description / PDF Quantity Rfq
CRT9007P

CRT9007P

Fluke Electronics

SINGLE ROW BUFFER (SRB)

1996

CRT9006-135P

CRT9006-135P

Fluke Electronics

SINGLE ROW BUFFER (SRB)

40

CRT9007A2P

CRT9007A2P

Fluke Electronics

SINGLE ROW BUFFER (SRB)

1589

CRT9006-83

CRT9006-83

Fluke Electronics

SINGLE ROW BUFFER (SRB)

92

CRT9006-83P

CRT9006-83P

Fluke Electronics

SINGLE ROW BUFFER (SRB)

5378

CRT9006-135

CRT9006-135

Fluke Electronics

SINGLE ROW BUFFER (SRB)

18

CRT9007AP

CRT9007AP

Fluke Electronics

SINGLE ROW BUFFER (SRB)

2031

CRT9007CP

CRT9007CP

Fluke Electronics

SINGLE ROW BUFFER (SRB)

644

CRT9007CCD

CRT9007CCD

Fluke Electronics

SINGLE ROW BUFFER (SRB)

724

CRT9007

CRT9007

Fluke Electronics

SINGLE ROW BUFFER (SRB)

498

CRT94C12P

CRT94C12P

Fluke Electronics

QUAD ROW BUFFER

587

CRT9212P

CRT9212P

Fluke Electronics

DOUBLE ROW BUFFER (DRB)

2564

USB2224-NE-05

USB2224-NE-05

Fluke Electronics

BUS POWERED USB 2.0 FLASH MEDIA

67

CRT9212CD

CRT9212CD

Fluke Electronics

DOUBLE ROW BUFFER (DRB)

742

USB2224-NE-04

USB2224-NE-04

Fluke Electronics

BUS POWERED USB 2.0 FLASH MEDIA

140

LPC47B373QFP

LPC47B373QFP

Fluke Electronics

SUPER I/O CONTROLLER FOR LPC BUS

16919

LPC47B377QFP

LPC47B377QFP

Fluke Electronics

SUPER I/O CONTROLLER FOR LPC BUS

9667

CRT9212

CRT9212

Fluke Electronics

DOUBLE ROW BUFFER (DRB)

74

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
BuffersSignal replication and drive strength enhancement without inversionMemory address lines, clock distribution networks
DriversHigh-current output for capacitive/inductive loadsMotor controllers, LED displays
ReceiversSignal conditioning and voltage-level translationRS-485 interfaces, sensor signal processing
TransceiversBidirectional signal conversion with isolationUSB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

  • Standard packages: DIP, SOIC, TSSOP, QFN
  • Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
  • Power rails: Separate VCC/GND for noise isolation
  • I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

ParameterDescriptionImportance
Data RateMaximum signal switching frequency (Mbps/Gbps)Determines communication speed
Supply VoltageOperating voltage range (e.g., 1.65-5.5V)Compatibility with system power
Drive StrengthOutput current capability ( 24mA typical)Load driving capacity
Propagation DelaySignal transmission time (ns range)Timing critical applications
ESD RatingElectrostatic discharge tolerance (kV)Reliability in harsh environments

5. Application Fields

  • Telecommunications: Base stations, optical modules
  • Industrial Automation: PLCs, fieldbus interfaces
  • Consumer Electronics: Smartphones, SSD controllers
  • Automotive: CAN transceivers, sensor hubs
  • Aerospace: Avionics data links

6. Leading Manufacturers and Products

ManufacturerKey ProductsFeatures
TISN74LVC245A8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicroL6384EHigh-side driver with protection features
NXPTJA1050High-speed CAN transceiver
ON SemiMC74VHC1GT45Low-voltage translator, 125MHz

7. Selection Guidelines

  • Match voltage levels between source and destination
  • Calculate required drive current ( IOL/IOH)
  • Consider package thermal characteristics
  • Select appropriate ESD protection level
  • Evaluate timing requirements (tPD, skew)
  • Verify industrial/automotive temperature ratings

8. Industry Trends

  • Increasing integration of protocol-specific transceivers
  • Sub-1V core voltage compatibility
  • EMI reduction through slew-rate control
  • Automotive-grade SiC/GaN driver development
  • AI-driven dynamic power optimization
  • Adoption of 3D packaging for high-density applications
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