Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVC2G126RA3-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V 8DFN	80000
74LVC1G06Z-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER INVERT 5.5V SOT553	3496
74LVC2G07FW5-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V 6DFN	150870000
74LVC1G17FZ4-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V 6DFN	1295
74LVC1G126QW5-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V SOT25	298012000
74AHCT1G125QSE-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V SOT353	5974
74LV07AS14-13 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V 14SO	0
74LV07AT14-13 Zetex Semiconductors (Diodes Inc.)	IC BUF NON-INVERT 5.5V 14TSSOP	12500
74LVCE1G07W5-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V SOT25	2003
74LVC2G125HK3-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V 8DFN	0
74LVC245AT20-13 Zetex Semiconductors (Diodes Inc.)	IC TXRX NON-INVERT 3.6V 20TSSOP	240852500
74LVC1G06FZ4-7 Zetex Semiconductors (Diodes Inc.)	IC BUF INVERT 5.5V X2-DFN1410-6	4210
74AHC1G126QW5-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V SOT25	300039000
74AUP1G126FS3-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 3.6V 4DFN	350050000
74LVC1G34QW5-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V SOT25	286518000
74LVC1G34FW5-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V 6DFN	4567
74HC125T14-13 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 6V 14TSSOP	158830000
74AUP2G07FZ4-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 3.6V 6DFN	20105000
74LVC1G126QSE-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V SOT353	130021000
74LVC1G125QSE-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 5.5V SOT353	15309000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications