Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
MAX4022ESD Analog Devices, Inc.	GAIN OF 2 BUFFER WITH R-R O/P	329
MAX7482ETI+ Analog Devices, Inc.	BUFFER/INVERTER BASED PERIPHERAL	4250
MAX4214EUK Analog Devices, Inc.	CLOSED-LOOP, R-R BUFFER	2573
MAX496CSE-T Analog Devices, Inc.	QUAD CLOSED-LOOP VIDEO BUFFER	5437
MAX468EWE Analog Devices, Inc.	TWO-CHANNEL TRIPLE VIDEO BUFFER	0
ADD8701ACP-REEL7 Analog Devices, Inc.	GAMMA BUFFER 32-PIN LFCSP EP T/R	12156
MAX1883EUP Analog Devices, Inc.	QUAD TFT/LCD DC-DC CONVERTER	10486
MAX4090EUT-T Analog Devices, Inc.	VIDEO BUFFER	0
MAX13103EEBX Analog Devices, Inc.	16-CH LOGIC-LEVEL TRANSLATOR	812
MAX6900ETTAEQ-T Analog Devices, Inc.	I2C-BUS-COMPATIBLE REAL-TIME CLO	1000
ADD8709WSTZ-REEL7 Analog Devices, Inc.	IC BUFFER 18 CHANNEL 48LQFP	12977
MAX9990ETP Analog Devices, Inc.	MAX9990 BUFFER	1637
ADD8709ASTZ-REEL7 Analog Devices, Inc.	IC BUFFER 18 CHANNEL 48LQFP	4500
MAX470CWE Analog Devices, Inc.	TWO-CHANNEL TRIPLE VIDEO BUFFER	0
MAX1884EUP Analog Devices, Inc.	QUAD TFT/LCD DC-DC CONVERTER	11963
ADD8506WRU-REEL7 Analog Devices, Inc.	6-CHANNEL LCD GAMMA BUFFER	5751
MAX1886EZK Analog Devices, Inc.	HIGH-CURRENT VCOM DRIVE BUFFER	1259
AD8320ARP Analog Devices, Inc.	IC PWR LINE DRVR 28POWER SOIC EP	44725
MAX1882EUG Analog Devices, Inc.	QUAD TFT/LCD DC-DC CONVERTER	1110
MAX9996ETP Analog Devices, Inc.	MAX9996 DOWNCONVERSION MIXER	89

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications