| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Analog Devices, Inc. |
IC ACCELERATOR I2C HOTSWAP 8MSOP |
1572 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
IC REDRIVER 4 CHAN I2C 16TQFN |
0 |
|
 |
Analog Devices, Inc. |
IC ACCELERATOR I2C HOTSWAP 8DFN |
835 |
|
 |
Texas Instruments |
IC REDRIVER RS422/RS485 1CH 8DIP |
248 |
|
 |
Texas Instruments |
IC REDRIVER LVDS 1CH 8WSON |
220 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
USB3 EQX V-QFN3590-42 |
1477 |
|
 |
Texas Instruments |
IC REDRIVER LVDS 1CH 8WSON |
2877 |
|
 |
Analog Devices, Inc. |
DUAL-RATE FIBRE CH REPEATER |
5522 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
PCIE EQX REDRIVER W-QFN3060-40 |
3475 |
|
|
PCI-EXPRESS GEN-4 X8 RETIMER |
0 |
|
|
|
Zetex Semiconductors (Diodes Inc.) |
USB C LINEAR REDRIVER |
3480 |
|
|
Sanyo Semiconductor/ON Semiconductor |
IC REDRIVER 2-PORT 16UQFN |
48000 |
|
|
PCI-EXPRESS GEN-4 X16 RETIMER |
0 |
|
|
|
Texas Instruments |
USB INTERFACE IC |
0 |
|
|
Analog Devices, Inc. |
PCM REPEATER |
0 |
|
|
Zetex Semiconductors (Diodes Inc.) |
ACTIVE DISPLAY W-QFN6040-40 |
0 |
|
|
Maxim Integrated |
IC EQUALIZER/REDVR 1CH USB3 WLP |
0 |
|
|
Texas Instruments |
PCIE 4.0, 16 GBPS, 8-CHANNE |
0 |
|
|
Sanyo Denki SanUPS Products |
SYNCHRONIZING SIGNAL SEPARATOR W |
10000 |
|
|
Texas Instruments |
UPI 2.0, 16 GBPS, 8-CHANNEL LINE |
0 |
|
Signal buffers, repeaters, and splitters are critical components in electronic systems for maintaining signal integrity, extending transmission distances, and distributing signals across multiple channels. These ICs act as intermediaries in data pathways, ensuring reliable communication between devices by amplifying weak signals, regenerating degraded waveforms, or dividing input signals into multiple outputs. Their importance has grown exponentially with the rise of high-speed data networks, IoT ecosystems, and advanced industrial automation systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Signal Buffers | High input impedance, low output impedance, signal amplification without inversion | Memory address drivers, bus interface circuits |
| Repeaters | Signal regeneration, noise filtering, timing recovery | Ethernet extenders, fiber optic communication |
| Splitters | Signal distribution, impedance matching, isolation between outputs | HDMI signal distribution, industrial sensor networks |
Typical IC construction includes: - Encapsulation: TSSOP, QFN, or BGA packages with 8-100+ pins - Internal Circuitry: Differential amplifiers, Schmitt triggers, termination resistors - Electrical Interface: Support for LVDS, RS-485, HDMI 2.1, or USB 3.2 standards - Thermal Management: Integrated heat spreaders or thermal pads for power dissipation
| Parameter | Importance |
|---|---|
| Bandwidth (0.1-10 Gbps) | Determines maximum data transfer rate |
| Propagation Delay (1-50 ns) | Impacts system timing synchronization |
| Signal-to-Noise Ratio (SNR) (>60 dB) | Measures transmission clarity |
| Power Consumption (100mW-2W) | Affects thermal design and efficiency |
| Impedance Matching (50 -100 ) | Minimizes signal reflections |
Key industries include: - Telecommunications: 5G base stations, optical network units - Consumer Electronics: Smart TVs, gaming consoles - Industrial Automation: PLC systems, sensor hubs - Automotive: CAN bus extenders, ADAS sensor interfaces - Medical Devices: MRI machine signal routing
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Texas Instruments | SN74LVC1G125 | Low-voltage buffer with 85MHz bandwidth |
| NXP Semiconductors | PCA9306 | I2C bus voltage-level translation |
| STMicroelectronics | TS3DS1240 | 4-channel HDMI buffer with 2.5Gbps per lane |
Key considerations: - Match bandwidth requirements with application data rates - Verify voltage level compatibility (e.g., 1.8V/3.3V/5V logic) - Assess drive strength needs for connected loads - Consider package type for PCB space constraints - Analyze power budget and thermal management requirements - Evaluate EMI/ESD protection features for harsh environments
Emerging developments include: - Integration with protocol conversion (e.g., USB-C to DisplayPort) - Development of AI-enhanced signal conditioning algorithms - Adoption of advanced packaging (3D stacking, SiP) - Push toward ultra-low power (<1mW standby) designs - Increased demand for automotive-grade parts (AEC-Q100 qualified) - Growth in wireless interface buffer solutions for 6G infrastructure