| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Texas Instruments |
IC REDRIVER LVDS 4CH 40WQFN |
0 |
|
 |
Texas Instruments |
IC REDRIVER I2C 1CH 400KHZ 8SOIC |
1391 |
|
 |
Texas Instruments |
SN65MLVD129 DUAL 1:4 LVTTL TO M- |
13032 |
|
 |
Analog Devices, Inc. |
IC ACCELERATOR I2C 1CH TSOT23-5 |
1670 |
|
 |
Texas Instruments |
IC MULTIPLEXER 1CH 36WQFN |
15 |
|
 |
Analog Devices, Inc. |
IC ACCELERATR I2C HOTSWAP 10MSOP |
3580 |
|
 |
Analog Devices, Inc. |
IC ACCELERATOR I2C 1CH 6DFN |
164 |
|
 |
Texas Instruments |
IC LVDS REPETR/TRANSLTR 8-SON |
597 |
|
 |
Texas Instruments |
IC REDRIVER DUAL USB 3.1 24VQFN |
0 |
|
 |
3.3 VOLT USB 3.1 DUAL CHANNEL LI |
32545 |
|
|
 |
NXP Semiconductors |
IC REDRIVER USB 3.0 12X2QFN |
0 |
|
 |
Texas Instruments |
IC REPEATER 28GBPS 135NFBGA |
0 |
|
 |
Maxim Integrated |
IC REDRIVER PCIE 4CH 42TQFN |
0 |
|
 |
Analog Devices, Inc. |
MAX4951 SATA I/II/III BIDIRECTIO |
9910 |
|
 |
NXP Semiconductors |
IC REDRIVER USB 3.0 1CH 24HVQFN |
650 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
IC REDRIVER PCIE 2CH 36TQFN |
0 |
|
 |
NXP Semiconductors |
IC REDRIVER USB 3.1 & DP 1.2 QFN |
7983 |
|
 |
Texas Instruments |
DS30BA101 3.125-GBPS DIFFERENTIA |
14971 |
|
 |
Texas Instruments |
PECL TO LVDS TRANSLATOR |
14955 |
|
 |
Renesas Electronics America |
IC REDRIVER SAS/SATA 100BGA |
0 |
|
Signal buffers, repeaters, and splitters are critical components in electronic systems for maintaining signal integrity, extending transmission distances, and distributing signals across multiple channels. These ICs act as intermediaries in data pathways, ensuring reliable communication between devices by amplifying weak signals, regenerating degraded waveforms, or dividing input signals into multiple outputs. Their importance has grown exponentially with the rise of high-speed data networks, IoT ecosystems, and advanced industrial automation systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Signal Buffers | High input impedance, low output impedance, signal amplification without inversion | Memory address drivers, bus interface circuits |
| Repeaters | Signal regeneration, noise filtering, timing recovery | Ethernet extenders, fiber optic communication |
| Splitters | Signal distribution, impedance matching, isolation between outputs | HDMI signal distribution, industrial sensor networks |
Typical IC construction includes: - Encapsulation: TSSOP, QFN, or BGA packages with 8-100+ pins - Internal Circuitry: Differential amplifiers, Schmitt triggers, termination resistors - Electrical Interface: Support for LVDS, RS-485, HDMI 2.1, or USB 3.2 standards - Thermal Management: Integrated heat spreaders or thermal pads for power dissipation
| Parameter | Importance |
|---|---|
| Bandwidth (0.1-10 Gbps) | Determines maximum data transfer rate |
| Propagation Delay (1-50 ns) | Impacts system timing synchronization |
| Signal-to-Noise Ratio (SNR) (>60 dB) | Measures transmission clarity |
| Power Consumption (100mW-2W) | Affects thermal design and efficiency |
| Impedance Matching (50 -100 ) | Minimizes signal reflections |
Key industries include: - Telecommunications: 5G base stations, optical network units - Consumer Electronics: Smart TVs, gaming consoles - Industrial Automation: PLC systems, sensor hubs - Automotive: CAN bus extenders, ADAS sensor interfaces - Medical Devices: MRI machine signal routing
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Texas Instruments | SN74LVC1G125 | Low-voltage buffer with 85MHz bandwidth |
| NXP Semiconductors | PCA9306 | I2C bus voltage-level translation |
| STMicroelectronics | TS3DS1240 | 4-channel HDMI buffer with 2.5Gbps per lane |
Key considerations: - Match bandwidth requirements with application data rates - Verify voltage level compatibility (e.g., 1.8V/3.3V/5V logic) - Assess drive strength needs for connected loads - Consider package type for PCB space constraints - Analyze power budget and thermal management requirements - Evaluate EMI/ESD protection features for harsh environments
Emerging developments include: - Integration with protocol conversion (e.g., USB-C to DisplayPort) - Development of AI-enhanced signal conditioning algorithms - Adoption of advanced packaging (3D stacking, SiP) - Push toward ultra-low power (<1mW standby) designs - Increased demand for automotive-grade parts (AEC-Q100 qualified) - Growth in wireless interface buffer solutions for 6G infrastructure