Interface - Serializers, Deserializers

Image Part Number Description / PDF Quantity Rfq
THCV213

THCV213

THine Solutions

IC SERIALIZER DUAL LVDS 48TQFP

0

THC63LVD103D

THC63LVD103D

THine Solutions

IC SERIALIZER SNGL LVDS 64TQFP

0

THC63LVD1027

THC63LVD1027

THine Solutions

IC SER/DESER DUAL LVDS 64TSSOP

0

THCV242

THCV242

THine Solutions

IC DESERIALIZER V-BY-ONE HS

0

THC63LVD1024

THC63LVD1024

THine Solutions

IC DESERIALIZER LVDS 144LQFP

0

THCV2911A-B

THCV2911A-B

THine Solutions

2LANE V-BY-ONEHS REPEATER 30QFN

0

THCV2911B

THCV2911B

THine Solutions

2LANE V-BY-ONEHS REPEATER 30QFN

0

THC63LVD1022

THC63LVD1022

THine Solutions

10BIT DUAL LVDS_LVCMOS 100TQFP

0

THC63LVD827-Q-B

THC63LVD827-Q-B

THine Solutions

8BIT DUAL LVCMOS_LVDS 72TFBGA

0

THCV233

THCV233

THine Solutions

1LANE LVDS_V-BY-ONEHS 48QFN

0

THCV245A

THCV245A

THine Solutions

2LANE MIPICSI-2_V-BY-ONEHS40QFN

0

THCV213-5-B

THCV213-5-B

THine Solutions

6BIT LVCMOS_V-BY-ONE 48TQFP

0

THCV231-Q-B

THCV231-Q-B

THine Solutions

1LANE LVCMOS_V-BY-ONEHS 32QFN

0

THCV236

THCV236

THine Solutions

1LANE V-BY-ONEHS_LVCMOS 64QFN

0

THCV226

THCV226

THine Solutions

4LANE V-BY-ONEHS_LVDS 128TQFP

0

THCV2911B-B

THCV2911B-B

THine Solutions

2LANE V-BY-ONEHS REPEATER 30QFN

0

THCV234

THCV234

THine Solutions

1LANE V-BY-ONEHS_LVDS 48QFN

0

THCV2911A

THCV2911A

THine Solutions

2LANE V-BY-ONEHS REPEATER 30QFN

0

THCS252

THCS252

THine Solutions

20CH TRANSCEIVER 48QFN

0

THCV219

THCV219

THine Solutions

1LANE LVCMOS_V-BY-ONEHS 64QFN

0

Interface - Serializers, Deserializers

1. Overview

Serializers/Deserializers (SerDes) are semiconductor devices that convert parallel data streams into serial formats (Serializer) and vice versa (Deserializer). These ICs enable high-speed data transmission in modern electronic systems by reducing physical signal lines while maintaining data integrity. SerDes technology is fundamental to high-bandwidth communication protocols in computing, automotive, and industrial applications.

2. Major Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
Point-to-Point SerDesDedicated link between two devices, low latencyPCIe interconnects, GPU memory interfaces
Embedded Clock SerDesIntegrated clock recovery, reduced signal linesDisplayPort, HDMI 2.0+ interfaces
Multi-Channel SerDesParallel channel bonding for higher throughput100G Ethernet optical modules
LVDS SerDesLow-voltage differential signaling, noise immunityIndustrial sensor interfaces

3. Structure & Composition

Typical SerDes architecture consists of:

  • Parallel data bus interface (4/8/16-bit width)
  • Phase-locked loop (PLL) for clock generation
  • Serializer/deserializer core with encoding/decoding logic
  • Differential signal drivers/receivers (CML/LVDS standards)
  • Common packages: QFN, BGA, TSSOP (14-256 pins)

4. Key Technical Specifications

ParameterDescriptionImportance
Data Rate100 Mbps to 112 Gbps per laneDetermines system bandwidth capacity
Bit Error Rate (BER)Typical 10-12 to 10-15Measures data transmission reliability
Power Consumption50mW-500mW per channelImpacts thermal design and efficiency
Jitter PerformanceRMS jitter <0.5psAffects signal integrity at high speeds
Protocol SupportStandards: PCIe 5.0, DisplayPort 1.4a, etc.Determines system compatibility

5. Application Areas

  • Telecommunications: 5G base stations, optical transceivers (QSFP28)
  • Automotive: Autonomous driving systems (GMSL SerDes for camera interfaces)
  • Industrial: Machine vision systems, industrial Ethernet (PROFINET)
  • Consumer Electronics: AR/VR headsets with embedded display interfaces

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsDS90UB953-Q124-bit color FPD-Link III, 600MHz clock rate
Analog DevicesADV7511HDMI 1.4 transmitter with 3D video support
NXP SemiconductorsS32K144Automotive general-purpose SerDes interface
STMicroelectronicsVL53L1XToF sensor with I2C interface SerDes

7. Selection Guidelines

Key selection criteria:

  • Match protocol requirements (e.g., GMSL vs. FPD-Link)
  • Calculate required bandwidth: Data Rate = (Resolution Color Depth Frame Rate)/Efficiency Factor
  • Verify voltage compatibility (1.2V-3.3V I/O standards)
  • Assess EMI/ESD protection requirements
  • Consider package thermal performance
  • Real-world example: Selecting MAX9271 for automotive camera systems requires checking 100m cable reach support and ASIL safety compliance.

8. Industry Trends

Emerging development directions:

  • 112Gbps+ per lane speeds for 800G Ethernet (IEEE 802.3df standard)
  • Integration with AI accelerators (CXL protocol support)
  • Advanced equalization techniques (DFE with 7-tap support)
  • Automotive functional safety (ISO 26262 ASIL-D compliance)
  • 3D-stacked SerDes for reduced form factor
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