Interface - Modems - ICs and Modules

Image Part Number Description / PDF Quantity Rfq
AD5700BCPZ-R5

AD5700BCPZ-R5

Analog Devices, Inc.

IC HART MODEM 24LFCSP

641

AD5700BCPZ-RL7

AD5700BCPZ-RL7

Analog Devices, Inc.

IC HART MODEM LP 24LFCSP

129

AD5700-1BCPZ-RL7

AD5700-1BCPZ-RL7

Analog Devices, Inc.

IC HART MODEM LP INT OSC 24LFCSP

35

73K224BL-IH/F

73K224BL-IH/F

Analog Devices, Inc.

73K224 SINGLE-CHIP MODEM

1542

AD5700-1ACPZ-RL7

AD5700-1ACPZ-RL7

Analog Devices, Inc.

IC HART MODEM LP INT OSC 24LFCSP

164

AD1801JS

AD1801JS

Analog Devices, Inc.

SINGLE-CHIP FAX/DATA/VOICE MODEM

8559

AD1801JST-REEL

AD1801JST-REEL

Analog Devices, Inc.

SINGLE-CHIP FAX/DATA/VOICE MODEM

157

AD5700-1BCPZ-R5

AD5700-1BCPZ-R5

Analog Devices, Inc.

IC HART MODEM 24LFCSP

0

AD5700ACPZ-RL7

AD5700ACPZ-RL7

Analog Devices, Inc.

IC HART MODEM LP 24LFCSP

932

73K224BL-IHR/F

73K224BL-IHR/F

Analog Devices, Inc.

73K224 SINGLE-CHIP MODEM

0

73M2901CL-IGT/F

73M2901CL-IGT/F

Analog Devices, Inc.

73M2901 SINGLE-CHIP MODEM

13973

73M2901CL-IGVR

73M2901CL-IGVR

Analog Devices, Inc.

73M2901 SINGLE-CHIP MODEM

2000

Interface - Modems - ICs and Modules

1. Overview

Interface modems ICs and modules are semiconductor devices that enable data communication between digital systems and analog transmission media. They convert digital signals to analog waveforms (modulation) and vice versa (demodulation), ensuring protocol compatibility across wired/wireless networks. These components are critical in telecommunications, industrial automation, IoT ecosystems, and embedded systems, forming the backbone of modern connected infrastructure.

2. Main Types and Functional Classification

TypeFunctionalityApplication Example
RS-232 TransceiversConvert TTL/CMOS logic to RS-232 voltage levels for point-to-point communicationSerial ports in industrial controllers
RS-485/422 ICsSupport multi-drop differential signaling for noise-immune long-distance communicationFactory automation networks
CAN ControllersImplement Controller Area Network protocol for vehicle bus systemsAutomotive ECUs, robotics
USB Interface ICsBridge USB protocols with microcontrollers or peripheral devicesUSB-to-serial converters
Ethernet PHYsPhysical layer transceivers for IEEE 802.3 standardsIndustrial Ethernet switches
Wireless ModemsSupport GSM/CDMA/LTE/5G protocols with RF front-endsTelematics, remote monitoring

3. Structure and Composition

Typical components include:

  • Signal conversion circuits (ADC/DAC, level shifters)
  • Protocol processing engines (UART, SPI, I2C interfaces)
  • Power management modules (voltage regulators, LDOs)
  • Electrostatic discharge (ESD) protection structures
  • Package types: DIP, SOIC, QFN, BGA

4. Key Technical Specifications

ParameterImportance
Data RateDetermines communication speed (e.g., 10Gbps Ethernet PHYs)
Signal IntegrityMeasured through jitter and noise immunity
Protocol CompatibilityEnsures adherence to standards (IEEE 802.11, 3GPP)
Power ConsumptionCritical for battery-powered IoT devices
Operating TemperatureIndustrial (-40 C to +85 C) vs. commercial range
Package SizeAffects PCB integration complexity

5. Application Fields

  • Industrial Automation: PLCs, SCADA systems
  • Telecommunications: 5G base stations, fiber optic transceivers
  • Automotive: CAN-FD networks, V2X communication modules
  • Consumer Electronics: Smart home gateways, wearables
  • Medical Devices: Remote patient monitoring systems

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Texas InstrumentsMAX3232 (RS-232 Transceiver)
STMicroelectronicsSTMFD CAN FD Controller
Nordic SemiconductornRF52840 (Bluetooth 5.2 SoC)
Sierra WirelessAirPrime EM7455 (LTE-A Module)
Analog DevicesADM2483 (Isolated RS-485 Transceiver)

7. Selection Guidelines

Key considerations:

  • Match protocol standards with system requirements
  • Verify voltage level compatibility (e.g., 1.8V vs. 5V logic)
  • Evaluate thermal management needs
  • Assess certification requirements (FCC, CE, ISO 26262)
  • Balance cost vs. performance metrics

8. Industry Trends

  • Migration to high-speed SerDes interfaces (PCIe 5.0, USB4)
  • Integration of AI acceleration in modem SoCs
  • Expansion of 5G mmWave and Open RAN architectures
  • Adoption of Time-Sensitive Networking (TSN) in industrial Ethernet
  • Development of ultra-low-power wake-on-radio capabilities
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