Interface - Modems - ICs and Modules

Part Number	Description / PDF	Quantity
MX604TN CML Microcircuits	V.23 COMPATIBLE MODEM	2077
A5191HRTLG-XTP Sanyo Semiconductor/ON Semiconductor	IC HART MODEM CMOS 32LQFP	5000
SI2493-C-FTR Silicon Labs	IC ISOMODEM SYSTEM-SIDE 24TSSOP	0
73M2901CE-IGV/F Maxim Integrated	IC MODEM 3.3V V.22BIS 32-TQFP	0
CMX869BD2-TR1K CML Microcircuits	LOW POWER V.32 BIS MODEM	1000
CD22212E1	SINGLE-CHIP 1200BPS MODEM	770
Z0220112VSGR4078 Zilog / Littelfuse	IC MODEM 2400BPS DSP AFE 44-PLCC	0
PXB4220EV3.4 IR (Infineon Technologies)	INTERWORKING ELEMENT FOR 8 E1/T1	131
CMX868AE2-TR1K CML Microcircuits	LOW POWER V.22 BIS MODEM	0
SI2415-C-FSR Silicon Labs	IC ISOMODEM SYST-SIDE DAA 16SOIC	0
AD5700BCPZ-R5 Analog Devices, Inc.	IC HART MODEM 24LFCSP	641
CMX869BD2 CML Microcircuits	LOW POWER V.32 BIS MODEM	274
SI2434-D-FTR Silicon Labs	IC ISOMODEM SYSTEM-SIDE 24TSSOP	0
CD22212E	SINGLE-CHIP 1200BPS MODEM	440
PX1011B-EL1/Q900551 NXP Semiconductors	PCI EXPRESS STAND-ALONE X1 PHY	154
CMX589AE2 CML Microcircuits	FULL-DUPLEX GMSK DATA MODEM	61
DYMD1724T11VCB	V.92 MODEM ANLG FRONT END 44LQFP	22
Z0221524ASGR4508 Zilog / Littelfuse	IC MODEM 2400BPS 44PLCC	0
SI2439-A-FM Silicon Labs	IC ISOMODEM 33.6KBPS 38-QFN	0
SI3008-B-FSR Silicon Labs	IC ISOMODEM FCC LINE-SIDE 8SOIC	0

Interface - Modems - ICs and Modules

1. Overview

Interface modems ICs and modules are semiconductor devices that enable data communication between digital systems and analog transmission media. They convert digital signals to analog waveforms (modulation) and vice versa (demodulation), ensuring protocol compatibility across wired/wireless networks. These components are critical in telecommunications, industrial automation, IoT ecosystems, and embedded systems, forming the backbone of modern connected infrastructure.

2. Main Types and Functional Classification

Type	Functionality	Application Example
RS-232 Transceivers	Convert TTL/CMOS logic to RS-232 voltage levels for point-to-point communication	Serial ports in industrial controllers
RS-485/422 ICs	Support multi-drop differential signaling for noise-immune long-distance communication	Factory automation networks
CAN Controllers	Implement Controller Area Network protocol for vehicle bus systems	Automotive ECUs, robotics
USB Interface ICs	Bridge USB protocols with microcontrollers or peripheral devices	USB-to-serial converters
Ethernet PHYs	Physical layer transceivers for IEEE 802.3 standards	Industrial Ethernet switches
Wireless Modems	Support GSM/CDMA/LTE/5G protocols with RF front-ends	Telematics, remote monitoring

3. Structure and Composition

Typical components include:

Signal conversion circuits (ADC/DAC, level shifters)
Protocol processing engines (UART, SPI, I2C interfaces)
Power management modules (voltage regulators, LDOs)
Electrostatic discharge (ESD) protection structures
Package types: DIP, SOIC, QFN, BGA

4. Key Technical Specifications

Parameter	Importance
Data Rate	Determines communication speed (e.g., 10Gbps Ethernet PHYs)
Signal Integrity	Measured through jitter and noise immunity
Protocol Compatibility	Ensures adherence to standards (IEEE 802.11, 3GPP)
Power Consumption	Critical for battery-powered IoT devices
Operating Temperature	Industrial (-40 C to +85 C) vs. commercial range
Package Size	Affects PCB integration complexity

5. Application Fields

Industrial Automation: PLCs, SCADA systems
Telecommunications: 5G base stations, fiber optic transceivers
Automotive: CAN-FD networks, V2X communication modules
Consumer Electronics: Smart home gateways, wearables
Medical Devices: Remote patient monitoring systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Texas Instruments	MAX3232 (RS-232 Transceiver)
STMicroelectronics	STMFD CAN FD Controller
Nordic Semiconductor	nRF52840 (Bluetooth 5.2 SoC)
Sierra Wireless	AirPrime EM7455 (LTE-A Module)
Analog Devices	ADM2483 (Isolated RS-485 Transceiver)

7. Selection Guidelines

Key considerations:

Match protocol standards with system requirements
Verify voltage level compatibility (e.g., 1.8V vs. 5V logic)
Evaluate thermal management needs
Assess certification requirements (FCC, CE, ISO 26262)
Balance cost vs. performance metrics

8. Industry Trends

Migration to high-speed SerDes interfaces (PCIe 5.0, USB4)
Integration of AI acceleration in modem SoCs
Expansion of 5G mmWave and Open RAN architectures
Adoption of Time-Sensitive Networking (TSN) in industrial Ethernet
Development of ultra-low-power wake-on-radio capabilities