Interface - Modems - ICs and Modules

Part Number	Description / PDF	Quantity
R6781-21	CONEXANT R6781 V.22 MODEM IC	0
R6764-39	CONEXANT R6764 ACF2 MODEM IC	0
PEF7071VV1.3	XWAY PHY11G, 10/100/1000 MBPS ET	0
USR80-12	CONEXANT USR80 K56 HCF MODEM IC	1738
R6819-12	CONEXANT R6819 ACF2 MODEM IC	0
R6764-34	CONEXANT R6764 ACFL MODEM IC	0
R6713-22	CONEXANT R6713 FAX 33600 MODEM I	0
PMB9617VV1.3FL	COSIC DTAM KDECT: BASE WITH ANSW	0
PSB8301VV1.1	XWAY WAV300 WI-FI CHIPSET	5230
R6764-29	CONEXANT R6764 ACF2 MODEM IC	0
PCT303W-C	CONEXANT HSP AC LINK MODEM IC	0
PLF2800EV1.2 IR (Infineon Technologies)	PURPLE L2+ ETHERNET SWITCH	0
Z0221524VSCR4508 Zilog / Littelfuse	IC MODEM 2400BPS 44PLCC	0
Z0292212VSCR3796 Zilog / Littelfuse	IC MODEM DATA PUMP/AFE 44-PLCC	0
Z0220516SSCR4292TR Zilog / Littelfuse	IC MODEM CTRL 28SOIC	0
Z0221524VSCR50A5TR Zilog / Littelfuse	IC MODEM CTRL 2400BPS 44PLCC	0
Z0220516SSCR4259 Zilog / Littelfuse	IC MODEM CTRL 86E34 28-SOIC	0
Z0220516SSCR4292 Zilog / Littelfuse	IC MODEM CTRL 86E34 28-SOIC	0
AMIS30585C5852RG Sanyo Semiconductor/ON Semiconductor	IC MODEM S-FSK HALFDUPLEX 28PLCC	0
SI3016-KSR Texas Instruments	IC EMBEDDED V.90 MODEM DSP	0

Interface - Modems - ICs and Modules

1. Overview

Interface modems ICs and modules are semiconductor devices that enable data communication between digital systems and analog transmission media. They convert digital signals to analog waveforms (modulation) and vice versa (demodulation), ensuring protocol compatibility across wired/wireless networks. These components are critical in telecommunications, industrial automation, IoT ecosystems, and embedded systems, forming the backbone of modern connected infrastructure.

2. Main Types and Functional Classification

Type	Functionality	Application Example
RS-232 Transceivers	Convert TTL/CMOS logic to RS-232 voltage levels for point-to-point communication	Serial ports in industrial controllers
RS-485/422 ICs	Support multi-drop differential signaling for noise-immune long-distance communication	Factory automation networks
CAN Controllers	Implement Controller Area Network protocol for vehicle bus systems	Automotive ECUs, robotics
USB Interface ICs	Bridge USB protocols with microcontrollers or peripheral devices	USB-to-serial converters
Ethernet PHYs	Physical layer transceivers for IEEE 802.3 standards	Industrial Ethernet switches
Wireless Modems	Support GSM/CDMA/LTE/5G protocols with RF front-ends	Telematics, remote monitoring

3. Structure and Composition

Typical components include:

Signal conversion circuits (ADC/DAC, level shifters)
Protocol processing engines (UART, SPI, I2C interfaces)
Power management modules (voltage regulators, LDOs)
Electrostatic discharge (ESD) protection structures
Package types: DIP, SOIC, QFN, BGA

4. Key Technical Specifications

Parameter	Importance
Data Rate	Determines communication speed (e.g., 10Gbps Ethernet PHYs)
Signal Integrity	Measured through jitter and noise immunity
Protocol Compatibility	Ensures adherence to standards (IEEE 802.11, 3GPP)
Power Consumption	Critical for battery-powered IoT devices
Operating Temperature	Industrial (-40 C to +85 C) vs. commercial range
Package Size	Affects PCB integration complexity

5. Application Fields

Industrial Automation: PLCs, SCADA systems
Telecommunications: 5G base stations, fiber optic transceivers
Automotive: CAN-FD networks, V2X communication modules
Consumer Electronics: Smart home gateways, wearables
Medical Devices: Remote patient monitoring systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Texas Instruments	MAX3232 (RS-232 Transceiver)
STMicroelectronics	STMFD CAN FD Controller
Nordic Semiconductor	nRF52840 (Bluetooth 5.2 SoC)
Sierra Wireless	AirPrime EM7455 (LTE-A Module)
Analog Devices	ADM2483 (Isolated RS-485 Transceiver)

7. Selection Guidelines

Key considerations:

Match protocol standards with system requirements
Verify voltage level compatibility (e.g., 1.8V vs. 5V logic)
Evaluate thermal management needs
Assess certification requirements (FCC, CE, ISO 26262)
Balance cost vs. performance metrics

8. Industry Trends

Migration to high-speed SerDes interfaces (PCIe 5.0, USB4)
Integration of AI acceleration in modem SoCs
Expansion of 5G mmWave and Open RAN architectures
Adoption of Time-Sensitive Networking (TSN) in industrial Ethernet
Development of ultra-low-power wake-on-radio capabilities