Interface - I/O Expanders

Part Number	Description / PDF	Quantity
MAX1608EEE Maxim Integrated	IC EXPANDER OCTAL BUS 16-QSOP	0
MAX1608EEE+ Maxim Integrated	IC EXPANDER OCTAL BUS 16-QSOP	3297
MAX7313DATG+ Maxim Integrated	IC EXPANDER 16PORT 24TQFN	0
MAX7300ATI+T Maxim Integrated	IC I/O EXPANDER I2C QFN	0
MAX7313DATG+T Maxim Integrated	IC EXPANDER 16PORT 24TQFN	0
DS4520E-W Maxim Integrated	IC I/O EXPANDER W/MEMORY 16TSSOP	0
MAX7326AEG+T Maxim Integrated	IC I/O EXPANDER I2C 16B 24QSOP	0
MAX7316AEE+ Maxim Integrated	IC I/O EXPANDER I2C 16B 16QSOP	0
MAX7328AAP+ Maxim Integrated	IC I/O EXPANDER I2C 8B 20SSOP	0
MAX7328AAP+T Maxim Integrated	IC I/O EXPANDER I2C 8B 20SSOP	0
DS4550E+T&R Maxim Integrated	IC I/O EXPANDER I2C 9B 20TSSOP	0
MAX7321ATE+TG104 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX7314ATG+TG05 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX16092UK+ Maxim Integrated	IC SUPERVISOR LOW POWER SOT-23	0
MAX7301ATL+GH7 Maxim Integrated	IC POWER MANAGEMENT	0
MAX7314AEG+TG05 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX7325AEG/V+ Maxim Integrated	IC PORT EXPANDER WITH 8 PUSH-PUL	0
MAX7301ATL+TG035 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX7313AEG+TG05 Maxim Integrated	INTEGRATED CIRCUIT	0
MAX7320ATE+TGA8 Maxim Integrated	INTEGRATED CIRCUIT	0

Interface - I/O Expanders

1. Overview

I/O Expanders are integrated circuits that provide additional input/output ports for microcontrollers, processors, or other digital systems. They enable peripheral expansion through standardized communication protocols (e.g., I2C, SPI) while maintaining signal integrity and system efficiency. These devices play a critical role in modern electronics by simplifying board design, reducing pin count requirements, and enabling scalable system architectures.

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
I2C I/O Expanders	2-wire serial interface, addressable ports, low-speed operation	Consumer electronics, sensor hubs
SPI I/O Expanders	High-speed 3-4 wire interface, daisy-chain capability	Industrial control systems, motor drivers
GPIO Expanders	General-purpose digital I/O with configurable direction/pull-up	Embedded systems, LED matrix controllers
UART I/O Expanders	Asynchronous serial communication expansion	Legacy device integration, communication modules

3. Structure & Composition

Typical I/O Expander ICs consist of: - Communication interface controller (I2C/SPI/UART) - Register arrays for configuration/status storage - Programmable port drivers (CMOS/TTL compatible) - Power management circuitry (low-power modes) - Protective structures (ESD protection, overcurrent) Available in standard packages: TSSOP, QFN, SOIC (8-28 pin configurations)

4. Key Technical Specifications

Parameter	Description	Importance
Channel Count	Number of programmable I/O lines (8-48 channels)	Determines peripheral expansion capability
Supply Voltage	Operating range (1.65V-5.5V)	Compatibility with system power architecture
Communication Speed	Up to 40MHz (SPI), 3.4MHz (I2C)	System latency and throughput requirements
Drive Strength	Output current per pin (4mA-20mA)	Peripheral driving capability
Power Consumption	Quiescent current ( A-nA range)	Battery-powered application viability

5. Application Fields

Consumer Electronics: Smartphones (button matrix expansion), Wearables
Industrial Automation: PLC modules, Sensor networks
Automotive Systems: Body control modules, Infotainment interfaces
Medical Devices: Portable diagnostic equipment, Patient monitoring
Smart Energy: Smart meters, Grid monitoring systems

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Features
Texas Instruments	PCA9555	16-bit I2C expander with interrupt generation
NXP Semiconductors	PCAL6416A	16-port GPIO with programmable pull-up resistors
Microchip Technology	MCP23017	20MHz SPI interface, 16-channel expansion
STMicroelectronics	STMPE1600	16-bit GPIO with touch screen controller interface

7. Selection Guidelines

Key considerations: - Required channel count with future expansion margin - Communication protocol compatibility (existing system bus architecture) - Voltage level matching with peripherals and MCU - Package type suitability for board space constraints - Operating temperature range for industrial/environmental applications - Integrated features (interrupt generation, pull-up resistors, PWM support) - Cost vs performance trade-offs for volume production

8. Industry Trends

Current development directions include: - Higher integration with analog/mixed-signal capabilities - Development of ultra-low-power variants (<1 A standby) - Increased channel density in compact packages (e.g., 24-ch in 3x3mm QFN) - Enhanced functional safety features (IEC 61508 compliance) - Support for emerging interface standards (I3C, enhanced SPI modes) - Embedded intelligence with local GPIO state machines