| Image | Part Number | Description / PDF | Quantity | Rfq |
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Zilog / Littelfuse |
IC LINE 21 DECODER 18-DIP |
0 |
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IC SMART VCHIP 18SOIC |
0 |
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Zilog / Littelfuse |
IC TIME OF DAY SMART V 18SOIC |
0 |
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IC TIME OF DAY SMART V 18-SOIC |
0 |
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IC SMART V-CHIP W/2ND I2C 18SOIC |
0 |
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IC SMART V-CHIP W/2ND I2C 18SOIC |
0 |
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Zilog / Littelfuse |
IC TIME OF DAY SMART V 18-SOIC |
0 |
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Zilog / Littelfuse |
IC TIME OF DAY SMART V 18-DIP |
0 |
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Zilog / Littelfuse |
IC CCD W/2ND I2C ADD 18-DIP |
0 |
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Zilog / Littelfuse |
IC SMART V-CHIP W/2ND I2C 18-DIP |
0 |
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Zilog / Littelfuse |
IC AUTO TIME SET 18-DIP |
0 |
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Zilog / Littelfuse |
IC AUTO TIME SET 18-SOIC |
0 |
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Zilog / Littelfuse |
IC CCD W/2ND I2C ADD 18-SOIC |
0 |
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Zilog / Littelfuse |
IC CLOSED CAPTION DECODER 18-DIP |
0 |
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Zilog / Littelfuse |
IC CLOSED CAPTION DECODER 18SOIC |
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IC CLOSED CAPTION DECODER 18SOIC |
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Zilog / Littelfuse |
IC ADPCM PROCESSOR 44LQFP |
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IC CLOSED CAPTION DECODER 18SOIC |
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Zilog / Littelfuse |
IC AUTO TIME SET 18-DIP |
0 |
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Zilog / Littelfuse |
IC ADPCM PROCESSOR 44QFN |
0 |
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Interface integrated circuits (ICs) serve as critical components for signal conversion and communication between different parts of electronic systems. Encoders, decoders, and converters enable data translation, protocol adaptation, and electrical signal transformation. These devices ensure compatibility between analog and digital domains, facilitate communication between microprocessors and peripheral devices, and optimize system efficiency. Their importance spans across modern electronics, including telecommunications, automotive systems, and industrial automation.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Encoders | Convert analog/digital inputs into coded digital outputs (e.g., binary, Gray code) | Position sensors, keypad interfaces |
| Decoders | Translate digital codes into analog/digital outputs | Memory address decoding, display drivers |
| ADCs (Analog-to-Digital) | Convert analog signals to digital representations | Temperature sensors, audio recording |
| DACs (Digital-to-Analog) | Convert digital data to analog voltages/currents | Audio equipment, motor control |
| Level Converters | Interface between devices with different voltage levels | Multi-voltage SoC designs |
| Protocol Converters | Bridge different communication protocols (I2C, SPI, UART) | Industrial IoT gateways |
Typical IC interface devices consist of: - Input/output signal conditioning circuits - Core conversion/transcoding logic (combinational/sequential circuits) - Reference voltage sources (for ADC/DAC) - Digital control registers - Clock generation/timing modules - Packaging with standard footprints (DIP, QFN, BGA)
| Parameter | Importance |
|---|---|
| Resolution (bits) | Determines signal precision (e.g., 12-bit ADC = 4096 levels) |
| Conversion Rate (SPS) | Impacts maximum signal bandwidth handling |
| Signal-to-Noise Ratio (SNR) | Measures analog performance quality |
| Propagation Delay | Critical for real-time control applications |
| Power Consumption | Affects battery-powered device efficiency |
| Interface Compatibility | Ensures seamless integration with system architecture |
Key industries include: - Telecommunications (5G base stations, optical transceivers) - Automotive (ADAS sensor interfaces, infotainment systems) - Industrial Automation (PLC modules, robotics) - Consumer Electronics (smartphones, wearables) - Medical Devices (ECG monitors, imaging equipment) - Aerospace (flight control systems, avionics)
| Manufacturer | Representative Products |
|---|---|
| Texas Instruments | ADS1256 (24-bit ADC), DAC8830 (16-bit DAC) |
| Analog Devices | AD7606 (16-bit SAR ADC), AD5686 (16-bit DAC) |
| NXP Semiconductors | PCA9306 (I2C voltage translator), MCX3460 (CAN transceiver) |
| Maxim Integrated | MAX11644 (10-channel ADC), MAX5174 (14-bit DAC) |
| STMicroelectronics | STM32F373 (built-in 24-bit sigma-delta ADC), LIS3DH (motion sensor with digital output) |
Key considerations: - Match resolution/speed requirements with application bandwidth - Ensure voltage level compatibility with system components - Consider thermal management requirements - Evaluate package size constraints - Verify operating temperature range (-40 C to +125 C for automotive) - Assess calibration requirements for precision applications
Current development directions include: - Integration of multiple functions in single chips (e.g., ADC+DSP) - Increased sampling rates (>1 GSPS for 5G) - Reduced power consumption through advanced process nodes (28nm FD-SOI) - Development of radiation-hardened devices for aerospace - AI-enhanced signal processing capabilities - Standardization of automotive-grade functional safety (ISO 26262)