Interface - Drivers, Receivers, Transceivers

Image Part Number Description / PDF Quantity Rfq
MAX232AESE+T

MAX232AESE+T

Maxim Integrated

IC TRANSCEIVER FULL 2/2 16SOIC

1230

MAX3245ECAI+

MAX3245ECAI+

Maxim Integrated

IC TRANSCEIVER FULL 3/5 28SSOP

756368

MAX3181EUK+T

MAX3181EUK+T

Maxim Integrated

IC RECEIVER 0/1 SOT23-5

2026

MAX3243EETJ+

MAX3243EETJ+

Maxim Integrated

IC TRANSCEIVER FULL 3/5 32TQFN

2021

MAX3243ECUI+

MAX3243ECUI+

Maxim Integrated

IC TRANSCEIVER FULL 3/5 28TSSOP

10010700

MAX3098EAEEE+

MAX3098EAEEE+

Maxim Integrated

IC RECEIVER 0/3 16QSOP

399

MAX3222CUP+

MAX3222CUP+

Maxim Integrated

IC TRANSCEIVER FULL 2/2 20TSSOP

3037814

MAX3243EUI+T

MAX3243EUI+T

Maxim Integrated

IC TRANSCEIVER FULL 3/5 28TSSOP

0

MAX3031ECUE+

MAX3031ECUE+

Maxim Integrated

IC DRIVER 4/0 16TSSOP

2496

MAX3490ECSA+

MAX3490ECSA+

Maxim Integrated

IC TRANSCEIVER FULL 1/1 8SOIC

7441400

MAX3463ESA+

MAX3463ESA+

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8SOIC

8814900

MAX207CWG+

MAX207CWG+

Maxim Integrated

IC TRANSCEIVER FULL 5/3 24SOIC

86180

MAX3226ECTE+

MAX3226ECTE+

Maxim Integrated

IC TRANSCEIVER FULL 1/1 16TQFN

1831980

MAX3318ECUP+

MAX3318ECUP+

Maxim Integrated

IC TRANSCEIVER FULL 2/2 20TSSOP

80

MAX214EWI+T

MAX214EWI+T

Maxim Integrated

IC TRANSCEIVER FULL 3/5 28SOIC

0

MAX481EESA+

MAX481EESA+

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8SOIC

1652200

MAX483CPA+

MAX483CPA+

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8DIP

21496050

MAX3095EPE+

MAX3095EPE+

Maxim Integrated

IC RECEIVER 0/4 16DIP

2641325

MAX13089EASD+T

MAX13089EASD+T

Maxim Integrated

IC TRANSCEIVER FULL 1/1 14SOIC

0

MAX3073EESD+

MAX3073EESD+

Maxim Integrated

IC TRANSCEIVER FULL 1/1 14SOIC

0

Interface - Drivers, Receivers, Transceivers

1. Overview

Interface drivers, receivers, and transceivers are critical IC components that enable signal transmission between devices in electronic systems. These circuits convert logic signals to appropriate voltage/current levels for reliable communication across different media. They play a vital role in modern electronics by ensuring signal integrity, protocol compatibility, and noise immunity in applications ranging from consumer devices to industrial automation systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Line DriversSignal level translation, impedance matching, differential signalingRS-485/RS-422 communication systems
Logic BuffersSignal amplification, fan-out control, voltage translationDigital circuit interfacing
Differential TransceiversHigh noise immunity, differential signal conversionEthernet (10BASE-T1L), CAN FD
IO-Link TransceiversBi-directional communication, parameter configurationIndustrial sensor networks

3. Structure and Composition

Typical physical structures include TSSOP, SOIC, and QFN packages with 8-64 pins. Key technical components:

  • Input protection circuits (ESD/clamp diodes)
  • Signal conditioning amplifiers
  • Voltage reference generators
  • Differential line drivers with current limiting
  • Receiver hysteresis control circuits
  • Protocol-specific encoding/decoding logic

4. Key Technical Specifications

ParameterImportance
Transmission Rate (Mbps)Determines maximum data throughput capability
Supply Voltage Range (V)Defines compatibility with system power architecture
Propagation Delay (ns)Affects system timing accuracy
Common-Mode Voltage RangeSpecifies noise immunity in industrial environments
ESD Rating (kV)Reliability indicator for harsh operating conditions
Power Consumption (mW)Key factor for battery-powered devices

5. Application Fields

Major application sectors:

  • Industrial Automation: PLCs, motor drives, fieldbuses
  • Automotive: CAN/LIN networks, ADAS sensors
  • Telecommunications: Optical modules, base stations
  • Consumer Electronics: Display interfaces, wearables
  • Aerospace & Defense: Avionics data buses

6. Leading Manufacturers and Products

ManufacturerProduct ExampleKey Features
Texas InstrumentsSN65HVD2303.3V CAN transceiver with 16Mbps rate
NXP SemiconductorsTJA1051High-speed CAN transceiver with partial networking
STMicroelectronicsL9963Battery cell interface IC with SPI communication
Analog DevicesADM2483Isolated RS-485 transceiver with integrated power

7. Selection Guidelines

Key factors for component selection:

  • Protocol compatibility (CAN, RS-485, LVDS, etc.)
  • Environmental requirements (temperature range, ESD protection)
  • Power budget constraints
  • PCB space limitations
  • Signal integrity requirements (jitter, skew)
  • EMI/EMC compliance needs

8. Industry Trends

Current development directions:

  • Increased integration with protocol accelerators
  • Higher data rates (>1Gbps) for 5G and automotive applications
  • Advanced packaging for reduced parasitics
  • Energy-efficient designs for IoT devices
  • Enhanced diagnostics and fault reporting capabilities
  • Optical interface integration for isolation applications
RFQ BOM Call Skype Email
Top