Interface - Drivers, Receivers, Transceivers

Image Part Number Description / PDF Quantity Rfq
MAX485ESA+T

MAX485ESA+T

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8SOIC

4519

MAX9122EUE+T

MAX9122EUE+T

Maxim Integrated

IC RECEIVER 0/4 16TSSOP

586

MAX3320TCAP+T

MAX3320TCAP+T

Maxim Integrated

IC TRANSCEIVER FULL 2/2 20SSOP

0

MAX3491ECSD+

MAX3491ECSD+

Maxim Integrated

IC TRANSCEIVER FULL 1/1 14SOIC

988

MAX14890EATJ+T

MAX14890EATJ+T

Maxim Integrated

IC RECEIVER 0/4 32TQFN

9702500

MAX14829ATG+

MAX14829ATG+

Maxim Integrated

IC TRANSCEIVER 2/2 24TQFN

788

MAX3221EETE+T

MAX3221EETE+T

Maxim Integrated

IC TRANSCEIVER FULL 1/1 16TQFN

9842500

MAX208CWG+T

MAX208CWG+T

Maxim Integrated

IC TRANSCEIVER FULL 4/4 24SOIC

7503000

MAX211ECWI+

MAX211ECWI+

Maxim Integrated

IC TRANSCEIVER FULL 4/5 28SOIC

53

MAX3463CPA+

MAX3463CPA+

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8DIP

350

MAX3043CSE+T

MAX3043CSE+T

Maxim Integrated

IC DRIVER 4/0 16SO

0

MAX3280EAUK+T

MAX3280EAUK+T

Maxim Integrated

IC RECEIVER 0/1 SOT23-5

12457

MAX13413EESA+

MAX13413EESA+

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8SOIC

9727200

MAX3080EPD+

MAX3080EPD+

Maxim Integrated

IC TRANSCEIVER FULL 1/1 14DIP

1251975

MAX237CNG+

MAX237CNG+

Maxim Integrated

IC TRANSCEIVER FULL 5/3 24DIP

761560

MAX3313EUB+T

MAX3313EUB+T

Maxim Integrated

IC TRANSCEIVER FULL 1/1 10UMAX

12500

MAX3089CSD+T

MAX3089CSD+T

Maxim Integrated

IC TRANSCEIVER FULL 1/1 14SOIC

0

MAX3345EEUE+

MAX3345EEUE+

Maxim Integrated

IC TRANSCEIVER FULL 1/1 16TSSOP

7104

MAX13444EASA+

MAX13444EASA+

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8SOIC

181000

MAX3095ESE+T

MAX3095ESE+T

Maxim Integrated

IC RECEIVER 0/4 16SO

5591

Interface - Drivers, Receivers, Transceivers

1. Overview

Interface drivers, receivers, and transceivers are critical IC components that enable signal transmission between devices in electronic systems. These circuits convert logic signals to appropriate voltage/current levels for reliable communication across different media. They play a vital role in modern electronics by ensuring signal integrity, protocol compatibility, and noise immunity in applications ranging from consumer devices to industrial automation systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Line DriversSignal level translation, impedance matching, differential signalingRS-485/RS-422 communication systems
Logic BuffersSignal amplification, fan-out control, voltage translationDigital circuit interfacing
Differential TransceiversHigh noise immunity, differential signal conversionEthernet (10BASE-T1L), CAN FD
IO-Link TransceiversBi-directional communication, parameter configurationIndustrial sensor networks

3. Structure and Composition

Typical physical structures include TSSOP, SOIC, and QFN packages with 8-64 pins. Key technical components:

  • Input protection circuits (ESD/clamp diodes)
  • Signal conditioning amplifiers
  • Voltage reference generators
  • Differential line drivers with current limiting
  • Receiver hysteresis control circuits
  • Protocol-specific encoding/decoding logic

4. Key Technical Specifications

ParameterImportance
Transmission Rate (Mbps)Determines maximum data throughput capability
Supply Voltage Range (V)Defines compatibility with system power architecture
Propagation Delay (ns)Affects system timing accuracy
Common-Mode Voltage RangeSpecifies noise immunity in industrial environments
ESD Rating (kV)Reliability indicator for harsh operating conditions
Power Consumption (mW)Key factor for battery-powered devices

5. Application Fields

Major application sectors:

  • Industrial Automation: PLCs, motor drives, fieldbuses
  • Automotive: CAN/LIN networks, ADAS sensors
  • Telecommunications: Optical modules, base stations
  • Consumer Electronics: Display interfaces, wearables
  • Aerospace & Defense: Avionics data buses

6. Leading Manufacturers and Products

ManufacturerProduct ExampleKey Features
Texas InstrumentsSN65HVD2303.3V CAN transceiver with 16Mbps rate
NXP SemiconductorsTJA1051High-speed CAN transceiver with partial networking
STMicroelectronicsL9963Battery cell interface IC with SPI communication
Analog DevicesADM2483Isolated RS-485 transceiver with integrated power

7. Selection Guidelines

Key factors for component selection:

  • Protocol compatibility (CAN, RS-485, LVDS, etc.)
  • Environmental requirements (temperature range, ESD protection)
  • Power budget constraints
  • PCB space limitations
  • Signal integrity requirements (jitter, skew)
  • EMI/EMC compliance needs

8. Industry Trends

Current development directions:

  • Increased integration with protocol accelerators
  • Higher data rates (>1Gbps) for 5G and automotive applications
  • Advanced packaging for reduced parasitics
  • Energy-efficient designs for IoT devices
  • Enhanced diagnostics and fault reporting capabilities
  • Optical interface integration for isolation applications
RFQ BOM Call Skype Email
Top