Interface - Drivers, Receivers, Transceivers

Image Part Number Description / PDF Quantity Rfq
HI-4853PSHF

HI-4853PSHF

Holt Integrated Circuits, Inc.

IC TRANSCEIVER HALF 1/1 8SOIC

0

HI-8586PSI

HI-8586PSI

Holt Integrated Circuits, Inc.

IC DRIVER 2/0 8ESOIC

1743

HI-4853CRH

HI-4853CRH

Holt Integrated Circuits, Inc.

IC TRANSCEIVER HALF 1/1 8CERDIP

60

HI-8591PSM

HI-8591PSM

Holt Integrated Circuits, Inc.

IC RECEIVER 0/1 8SOIC

0

HI-1573PSIF

HI-1573PSIF

Holt Integrated Circuits, Inc.

IC TRANSCEIVER 20ESOIC

0

HI-3220PQIF

HI-3220PQIF

Holt Integrated Circuits, Inc.

IC RECEIVER FULL 0/16 80PQFP

34

HI-4854PSIF

HI-4854PSIF

Holt Integrated Circuits, Inc.

IC TRANSCEIVER FULL 1/1 8SOIC

0

HI-3000CRH

HI-3000CRH

Holt Integrated Circuits, Inc.

IC TRANSCEIVER HALF 1/1 8CERDIP

0

HI-8597PSTF

HI-8597PSTF

Holt Integrated Circuits, Inc.

IC DRIVER 2/0 16SOIC

0

HI-8584PQT-10

HI-8584PQT-10

Holt Integrated Circuits, Inc.

IC TRANSCEIVER 52PQFP

0

HI-1575PQI

HI-1575PQI

Holt Integrated Circuits, Inc.

IC TRANSCEIVER 2/2 32PQFP

0

HI-8588PSI-10

HI-8588PSI-10

Holt Integrated Circuits, Inc.

Single Receiver 8-Pin SOIC N

300

Interface - Drivers, Receivers, Transceivers

1. Overview

Interface drivers, receivers, and transceivers are critical IC components that enable signal transmission between devices in electronic systems. These circuits convert logic signals to appropriate voltage/current levels for reliable communication across different media. They play a vital role in modern electronics by ensuring signal integrity, protocol compatibility, and noise immunity in applications ranging from consumer devices to industrial automation systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Line DriversSignal level translation, impedance matching, differential signalingRS-485/RS-422 communication systems
Logic BuffersSignal amplification, fan-out control, voltage translationDigital circuit interfacing
Differential TransceiversHigh noise immunity, differential signal conversionEthernet (10BASE-T1L), CAN FD
IO-Link TransceiversBi-directional communication, parameter configurationIndustrial sensor networks

3. Structure and Composition

Typical physical structures include TSSOP, SOIC, and QFN packages with 8-64 pins. Key technical components:

  • Input protection circuits (ESD/clamp diodes)
  • Signal conditioning amplifiers
  • Voltage reference generators
  • Differential line drivers with current limiting
  • Receiver hysteresis control circuits
  • Protocol-specific encoding/decoding logic

4. Key Technical Specifications

ParameterImportance
Transmission Rate (Mbps)Determines maximum data throughput capability
Supply Voltage Range (V)Defines compatibility with system power architecture
Propagation Delay (ns)Affects system timing accuracy
Common-Mode Voltage RangeSpecifies noise immunity in industrial environments
ESD Rating (kV)Reliability indicator for harsh operating conditions
Power Consumption (mW)Key factor for battery-powered devices

5. Application Fields

Major application sectors:

  • Industrial Automation: PLCs, motor drives, fieldbuses
  • Automotive: CAN/LIN networks, ADAS sensors
  • Telecommunications: Optical modules, base stations
  • Consumer Electronics: Display interfaces, wearables
  • Aerospace & Defense: Avionics data buses

6. Leading Manufacturers and Products

ManufacturerProduct ExampleKey Features
Texas InstrumentsSN65HVD2303.3V CAN transceiver with 16Mbps rate
NXP SemiconductorsTJA1051High-speed CAN transceiver with partial networking
STMicroelectronicsL9963Battery cell interface IC with SPI communication
Analog DevicesADM2483Isolated RS-485 transceiver with integrated power

7. Selection Guidelines

Key factors for component selection:

  • Protocol compatibility (CAN, RS-485, LVDS, etc.)
  • Environmental requirements (temperature range, ESD protection)
  • Power budget constraints
  • PCB space limitations
  • Signal integrity requirements (jitter, skew)
  • EMI/EMC compliance needs

8. Industry Trends

Current development directions:

  • Increased integration with protocol accelerators
  • Higher data rates (>1Gbps) for 5G and automotive applications
  • Advanced packaging for reduced parasitics
  • Energy-efficient designs for IoT devices
  • Enhanced diagnostics and fault reporting capabilities
  • Optical interface integration for isolation applications
RFQ BOM Call Skype Email
Top